- Jan 31, 2000
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http://www.coolermaster.com/product.php?product_id=6809
The TPC 812 uses 2 separate cooling technologies to transfer heat heat pipes and vertical vapor chambers.
Ready for overclocking, benchmarking and silent cooling.
The first-ever CPU heatsink to use vertical vapor chamber technology.
100% pure polished copper base combined with improved soldering technologies for the best thermal transfer.
Special fin design heatsink receives concentrated cold airflow.
Improved air pressure design and fan mounting system.
Seems like a nice heatsink. The new Vapor Chamber technology is supposed to rival the closed-loop watercooling setups. Should be available in retail channel anytime now.
I'll post reviews once they come in.
The TPC 812 uses 2 separate cooling technologies to transfer heat heat pipes and vertical vapor chambers.
Ready for overclocking, benchmarking and silent cooling.
The first-ever CPU heatsink to use vertical vapor chamber technology.
100% pure polished copper base combined with improved soldering technologies for the best thermal transfer.
Special fin design heatsink receives concentrated cold airflow.
Improved air pressure design and fan mounting system.
Seems like a nice heatsink. The new Vapor Chamber technology is supposed to rival the closed-loop watercooling setups. Should be available in retail channel anytime now.
I'll post reviews once they come in.