However I guess they did not use SSDs (that benefit from its built-in controller logic etc), but some other separate NAND chip when testing. The details on that are scarce.
Correct, one of the slides does compare 3D XPoint against NAND across a PCIe NVMe interface with a claimed 10x performance increase - http://www.legitreviews.com/3d-xpoi...nd-micron-to-be-1000x-faster-than-nand_169795 Regardless, I'd expect one of the primary benefits of 3D XPoint versus NAND is that it can be treated like DRAM - no need for fancy controllers to work around the inherent weaknesses of NAND.
As that implies, the primary usage case for this is bye bye NAND for any high performance storage initially... and for everything eventually. Initial pricing is likely going to be high until more capacity is brought online. The question for long-term viability is comparative cost per wafer to 3D NAND - the initial product looks to be a ~217mm^2 die size for 128 Gb... by comparison Samsung's 128 Gb 24 layer MLC is supposedly 133mm^2 and Intel/Micron's 256 Gb 32 layer MLC is around 175mm^2. (Keep in mind that capacity for MLC is number of storage elements times 2.) aka, it's already higher density than 3D NAND with only two layers.