Doesn't match up with the work put into Pinnacle Ridge on other fronts. Cache latencies got tightened, IF latencies got tightened, memory controller is entirely different (don't ask me how I know that ), branch prediction got updated, and 12nm LP requires you to recompile and optimize the design either way. You can't just copy paste the design, even if it's lower effort than moving to a different node.
Whatever cell density they choose, it wasn't done for the sake of design cost savings, but rather what they think will be best for them in terms of die size/performance. Otherwise they'd just use GloFo's matured 14nm process.
So if IMC is different then can we expect it to work with 3600 or more, ram kit ?
With support ram above 3200 and faster and tighter IF, then the ipc can gain more than 15%