Originally posted by: taltamir
http://www.anandtech.com/mb/showdoc.aspx?i=3661
Basically a lot of the pins from sockets made by foxxcon do not make good contact, resulting in more power via same pins, resulting in burned out chips when overclocking intensively.
The question I have is, if there are connection issues, wouldn't it be a problem for non overclockers due to transmission issues on data pins? or are they the same pins every single time and all those pins are power pins?
These were discovered after running under a phase change cascade, at the temperatures that Raja was running it is a whole different game plan.
"The picture above is after our Core i7 870 (LGA-1156) processor was overclocked up to 5.19GHz using our cascade with a
-102° Celsius evaporator head temperature under full-load."
In a typical product interface environment (IE: Mating surfaces) the blueprint would be broken down by a datum scheme,(IE: Primary,Secondary,Tertiary) and appropriate Geometric Dimensioning, and Tolerancing (IE: Parallelism, Perpendicularity, Surface Finish, Profile of a surface, profile of a line etc...) usually referenced off of that datum scheme, in addition to surface finishes, and the temperature, and environmental conditions that this would be measured.(IE: 20c@50% humidity yada yada yada)
These are the conditions that went into the "Design Intent" of the product.
At the temps that Raj had that it would have had all of the components slightly "smaller" than they would be at ambient.
There are many different kinds of manufacturing processes involved in the production of those Sockets:
1,) Stamping - Clamp Lid & Base (Usually a Six Sigma Process)
2,) Injection Molding - Base (Usually a Six Sigma Process)^
but can be subject to poor process control (IE: Re-grind content vs Virgin Material or low quality sub - grade material)
3,) Cold Forming - Pins (Usually not a Six Sigma Process)^
Has potential for variation due to many potential variables.
In this picture there is clearly a geometric pattern to where Raj was seeing this issue.
http://www.anandtech.com/GalleryImage.aspx?id=7031
If you were to yank that socket off, and look at the back, there were probably a hollow base with re-enforcement ribs with a similar layout. (In mirror image) -
A common cost saving technique
The LOTES socket I would guess went with a monolithic base (IE: Solid resin)
I'm not going to rag Raja Gill (he's a close friend of Lal) but what he has found is well outside of the design intent for a "Mainstream Motherboard" but it would be good information going to Foxconn.
Lal and Raja should be commended for having the balls to speak out about it.. no doubt there !!
If you were to "Design for Six Sigma" this would clearly be a scenario that would not have been anticipated by the designers. (IE: the Foxconn Team)
TYCO/LOTES being Aerospace (United Technologies) as well, would opt for a more conservative approach.
With all this being said this product is a "mainstream consumer" product there will always be cost savings involved.
Does this really mean anything to the "Average Joe" not really.
Would I eyes wide open buy a MoBo with a Foxconn Socket ?
Yes without a doubt....
I don't do this to my equipment
"The picture above is after our Core i7 870 (LGA-1156) processor was overclocked up to 5.19GHz using our cascade with a -102° Celsius evaporator head temperature under full-load."
Enough said...