- Jan 7, 2007
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http://semiaccurate.com/2013/08/15/panasonic-make-a-10-micron-thick-carbon-phone-heatsink/
10 micron thick fabric like sheet with 2d heat conductivity in diamond range.
PGS for thin applications and drawing heat away from PCB. primarily targeted for mobile, but i wonder if it could be adapted for desktop/notebook. the 2d aspect seems to be the critical hump.
10 micron thick fabric like sheet with 2d heat conductivity in diamond range.
PGS for thin applications and drawing heat away from PCB. primarily targeted for mobile, but i wonder if it could be adapted for desktop/notebook. the 2d aspect seems to be the critical hump.