"You can take the same chip and put it in a small, thin form factor, even a fanless design if you so like, or scale all the way up to a higher-TDP design. The performance of the silicon will scale based on the thermal budget of the device versus picking a specific silicon for, let's say, smaller TDPs and different silicon for larger TDPs. It provides a lot of flexibility and operational efficiency, if you will, for our customers, and that's the grounds of the design that we have."
"So I'll just say any customer for that matter, we can pick a customer and let's say the silicon...we ship it to them. We ship them a Snapdragon X Elite silicon that's now sitting in their warehouse. That one silicon, that exact same silicon, they can make as late-binding a decision as they like to put that silicon in a small, fanless form-factor device, or take that same silicon and put it in a higher TDP envelope, providing that performance. That exact piece of silicon sitting at their warehouse that Qualcomm has already shipped can go into multiple form factors. It's their choice. That completely simplifies the operations piece of the story, versus, “This is an X-TDP, a Y-TDP, a Z-TDP.”