GloFo is not in the gutter, they dropped out completely with regard to leading edge nodes.
The text for the €7.4B GF/ST chip act literally states: continue investing in the development of the next generation of FD-SOI technologies.
Where that $1.5B Chips Act which has this: "
New State-of-the-Art 300 mm Fab: The construction of a new, large-scale 300 mm fabrication facility that is expected to produce high value technologies not currently available in the U.S."
Is meant to be prepared to be thee leading edge US fab for FDX.
Which should be the one to actually produce this:
With that no clue if Snapdragon would use FDX in main AP. However, the newcomers on FDX should basically curb-stomp Snapdragon 200/2 series.