Discussion RDNA 5 / UDNA speculation

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branch_suggestion

Senior member
Aug 4, 2023
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If Medusa Halo has a WoW stacked GPU then surely the flagship dGPU will too.
To justify it would require going a bit higher than $1k MSRP unless the target is ~5090
I think if you build a config, that after the OEM and retailers cut starts around $1.5k MSRP and AMD gets 50% GM that would allow for a big enough part to send the 5090 deep into the shadow realm.
The roadmap shown is legit, but it seems logical that if you were going after the halo segment, you wouldn't release any indication until you absolutely have to.
It is not impossible, maybe the part comes 6-12 months after the initial RDNA5 parts.
 

Tuna-Fish

Golden Member
Mar 4, 2011
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They can't go LPDDR6 for the mainstream products for a while, but there should be supply for a relatively low-volume flagship product in 2026. AMD went DDR5 first in notebook chips too, iirc 9 months before desktop.
Flagship dGPU gets to access super fast GDDR7 up to 512bit. Medusa Halo will probably go with 192 or 384bit LPDDR6.
If Medusa Halo has stacked memory for the GPU, I'd make a bet that it's 192b LPDDR6.

There are limits to how pricy products the market will bear, all these things cost money, and it sort of makes sense for them to trade off a larger ∞$ against a wider memory interface.
 

branch_suggestion

Senior member
Aug 4, 2023
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Because non-cringe MFMA implementation is only possible with SoIC. Mainly though it is provocative, it gets the people going.
Flagship dGPU gets to access super fast GDDR7 up to 512bit. Medusa Halo will probably go with 192 or 384bit LPDDR6.
I think Medusa Halo will be 384-bit LPDDR5X using 2 LPCAMM modules optimally.
LPDDR6 will be pretty scarce and expensive.
For the dGPU, GDDR7 will be faster, more available and cheaper to a degree than today so you could just keep it simple with a mono N3P part.
But there is a size where the optimal perf/cost crossover is a smaller GDDR7 bus with a fat MALL stacked below the compute.
Or you could have both a fat bus and fat cache, though a 512b stacked part would need insane compute to justify such bandwidth.
Then again NV went all out on GB202 bandwidth and yeah, kinda doesn't have the compute to justify it.
3GB dies will also be quite common by then, that can be a big consideration moreso on smaller die configs.
Unless by flagship you mean the Instinct line.
Instinct spares no expense for absolute performance. It uses the best tech available at the time it is made without throwing yields out the window.
So yeah, MI400 and Venice Dense are gonna hold back nothing.
 
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branch_suggestion

Senior member
Aug 4, 2023
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That's 3 LPCAMM and also breaks platform continuity. No bueno.
Yeah the current ones are 128b, feels like 5X has been around for a good while.
So yeah same as STXH with maybe a bit more clocks. Would like memory to scale between them but the cartel is a harsh mistress.
It is a nice new swimlane, but it is really funny that without MoP bandwidth for flagship Windows SoCs will remain below M1 Max for the foreseeable future.
 
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branch_suggestion

Senior member
Aug 4, 2023
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N4C may have died, but its legacy lives on.
And assuming ~retscale AIDs would likely necessitate active Si bridges.
In essence these are the only kinds of parts that can justify CoW stacking, lower volume than client and extremely high ASP.
So yeah, N4C really would've served as a derisk for MI400, the client plan shifted to WoW everything.
Problem with WoW is to scale beyond one stack would require a 2-hi silicon bridge with an added CoW stage, which is possible but another level of TSV is a whole lotta complexity or CoWoS which is not as good and supply limited.
 
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