I had to RMA my Intel DG965 MB, so I removed my E6600 C2D cpu and stock Intel HSF. The cpu was only on the MB for a day. Both the cpu and heatsink now have a thin layer of the original compound.
When the replacement mb arrives, can I just reinstall the cpu and HSF, or do I need to clean off the thermal compound and reapply new thermal compound?
CPU: C2D E6600
MB: Intel DG965
Stock Heatsink and fan
When the replacement mb arrives, can I just reinstall the cpu and HSF, or do I need to clean off the thermal compound and reapply new thermal compound?
CPU: C2D E6600
MB: Intel DG965
Stock Heatsink and fan