As crazy as it may sound, AMD may want to experiment with dual chip on interposer before the next gen. I think you may be right in that it could be 2 binned Polaris 480 on an interposer. I was going to say highly/ specially binned, but AMD's been letting voltage slip too high on for multiple generation of chips now, so binning AMD's chips for such a card can't be that labour/ time intensive.
Absolutely. They've flat out raised voltage across the board so that all chips meet the required launch clock targets; whether they required it or not. It appears most didn't; as per reviews.
Also, AMD would have to design chips with dual-chip config in mind from the very beginning. Is there a way to verify if 480 has those bumps, as 3DVagabond mentioned !?
If so, july-dec months present them the perfect opportunity to test this feature with 480's as they routinely slap together CPU & GPU's to make APU's for XB1/PS4..
I dont have much knowledge abt this process so don't know ;-]
Again, AMD never shy away from experimenting so who knows.. they co-developed HBM & successfully implemented the same.. Before anyone else..