One of the uArchitecture diagram IDC posted days ago got me interested in the next gen AMD Bulldozer architecture (K11). Since I'm not a professional in the hardware field that diagram meant little to me. So I dug a bit in various sites and found out quite a bit interesting information about BD, all in layman's terms.
Here are some facts for it: (keep in mind it's slated for 2011 so changes can occur)
1. Scorpius Platform (AM3 socket)
2. Zambezi CPU 4 and 8 core Bulldozer CPU
4. 512 KB L2/core, 8-12MB combined L3
5. 4x HyperTransport 3.0 interconnects (6.4 GT/s)
6. designed to take specialized coprocessors (encryption, graphics, etc)
7. new SSE5 instruction sets
8. 32nm process
10. possibly quad channel DDR3 controller (massive bandwidth)
11. each core is Multithreaded like HyperThreading but AMD uses individual physical Integer Units for each thread.
12. ETA=H1 or H2 2011 (sampling start in 2010)
13. Llano=4core/APU/uses PhenomII core (not based on BD)
14. BD design work started in year 2005 (from time of failed AMD-NV merger)
15. desktop TDP (10W-100W), portable variant (1-10W TDP)
16. M-SPACE design (modular core design, like LEGO blocks, multiple specialized
core attached to the main cores, scale to any available space)
17. LGA packaging for better contacts (no pins, just like current Intel chips)
18. The DDR3 controller can do up to DDR3-2000+ giving 32Gb/sec mem bandwidth
Edit: updated new info from Anand article on road map.
http://www.anandtech.com/cpuchipsets/showdoc.aspx?i=3673&p=1
just by reading those specs if they are indeed true, the new BD will be head and shoulders above the current K10 generation almost in every conceivable aspect. From what is known about BD it looks like it's designed to scale to very high core counts far beyond the 32nm's 8 to 12 cores. So as process technology improves, AMD probably can use the same BD design to release higher core counts as it becomes physically and thermally possible to build them.
Here are some facts for it: (keep in mind it's slated for 2011 so changes can occur)
1. Scorpius Platform (AM3 socket)
2. Zambezi CPU 4 and 8 core Bulldozer CPU
4. 512 KB L2/core, 8-12MB combined L3
5. 4x HyperTransport 3.0 interconnects (6.4 GT/s)
6. designed to take specialized coprocessors (encryption, graphics, etc)
7. new SSE5 instruction sets
8. 32nm process
10. possibly quad channel DDR3 controller (massive bandwidth)
11. each core is Multithreaded like HyperThreading but AMD uses individual physical Integer Units for each thread.
12. ETA=H1 or H2 2011 (sampling start in 2010)
13. Llano=4core/APU/uses PhenomII core (not based on BD)
14. BD design work started in year 2005 (from time of failed AMD-NV merger)
15. desktop TDP (10W-100W), portable variant (1-10W TDP)
16. M-SPACE design (modular core design, like LEGO blocks, multiple specialized
core attached to the main cores, scale to any available space)
17. LGA packaging for better contacts (no pins, just like current Intel chips)
18. The DDR3 controller can do up to DDR3-2000+ giving 32Gb/sec mem bandwidth
Edit: updated new info from Anand article on road map.
http://www.anandtech.com/cpuchipsets/showdoc.aspx?i=3673&p=1
just by reading those specs if they are indeed true, the new BD will be head and shoulders above the current K10 generation almost in every conceivable aspect. From what is known about BD it looks like it's designed to scale to very high core counts far beyond the 32nm's 8 to 12 cores. So as process technology improves, AMD probably can use the same BD design to release higher core counts as it becomes physically and thermally possible to build them.
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