I think that, while it's not a home run, the event actually bolstered Adored's cred more than it hurt it.
A 16 core SKU is obviously planned. It's not just that there's space for another chiplet, but you can actually see the physical imprint in the substrate when Lisa is waving the chip around. It's not a compression artifact, and even though it's visible in a still it's undeniably obvious in motion.
And if Ryzen 3 is launching about mid year, it would be foolish to demo >8C parts this early or demand for current parts would drop off a cliff, especially for enthusiasts.
And that whole confusion about Ryzen 3 using chiplets but no IO die that one source forwarded to AdoredTV? It's entirely possible that a source might have seen the 1+1 configuration shown off at CES and mistakenly interpreted that as "large die with cores + IO combined with smaller die with only cores."
How about the 5 GHz 16 core stuff everyone was so in doubt about? Well, the 8c part was likely running somewhere close to that frequency (or at least in the high 4 GHz range), probably with a bit of extra voltage to assure stability in a demo setting, and was only drawing about 75W at full load by AT's rough estimate. Add six months development time, binning, and a well set up turbo implementation and that seems easily doable now. Yesterday it looked closer to wishful thinking.