Atari2600
Golden Member
- Nov 22, 2016
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look at what people do on their threadrippers/i9....16C with 16/32GB RAM?really a WS workload..more like the cinebench runners
Is there a poll or dataset of what HEDTs are used for?
look at what people do on their threadrippers/i9....16C with 16/32GB RAM?really a WS workload..more like the cinebench runners
if AMD releases 16C AM4 ryzen it will destroy the TR ecosystem and pretty much give a signal that previous HEDT is obsolete
they should give 16C desktop more time, 12C is enough
Well, not counting any professional uses , our DC team has over 30 active people, and every one drools at the thought of more cores. My over 400 threads on 18 machines is dwarfed by some of our people, My sons workplace (drafting firm) has a minimum of 8 cores on their machines. I bet they would love 16 cores at a decent price.Is there a poll or dataset of what HEDTs are used for?
Ryzen TR Epyc
Cores <= 8 <= 32 <= 32
PCIe lanes 24 64 128
Memory channels 2 4 8
TDP <= 105W <= 250W <= 180W
Overclockable? unlocked unlocked locked
I think there's still sufficient room for all three product lines being separate. This is what it currently looks like:
I don't see the issue in doubling the numbers of cores in all three cases. HEDT users that only relied on a (now lowish) amount of cores can drop to AM4, but that will come with less PCIe lanes, less memory channels and less TDP headroom as standard. Likewise Epyc targets a different market than TR, with the former optimized for efficiency with locked specs and the latter being the crèam de la crèam for overclocking usage binning wise.Code:Ryzen TR Epyc Cores <= 8 <= 32 <= 32 PCIe lanes 24 64 128 Memory channels 2 4 8 TDP <= 105W <= 250W <= 180W Overclockable? unlocked unlocked locked
For those of us that are deaf, and there is no CC available on that video, can you briefly summarize for me ?Yes, this, so much this. Thank you!
For everyone complaining about a TR system but would never buy one and doesn't own one, watch this.
( Affordable, high bandwidth, high IO ) HEDT is a HUGE market that is completely different than what a desktop or server system targets.
For those of us that are deaf, and there is no CC available on that video, can you briefly summarize for me ?
Maybe we will finally be able to use ddr3200 in all four memory slots and be able to run them at their rated speed without much hassle.
Ryzen 3000 certified for faster memory
https://www.guru3d.com/news-story/ryzen-3000-zen-2-cpus-get-jedec-3200-mhz-specification.html
Thank you very much. I really am deaf. It happened before my cancer surgery, and was most likely caused by the cancer drugs they used to try and kill the cancer.(that didn't work) So I have been deaf for about 6 months now. Just thought I would let you know that I really was serious.AMD is highlighting how TR at the company that makes Cortex. working with IMF files, rendering 6k and 8k video, out running their dual Xeon systems, 3-4 fps to 24 fps, realtime IMF work, no TR specs specified that they used though. And saying how you didn't need a complicated expensive setup to do it.
http://www.mtifilm.com/cortex-hardware
CORTEX Hardware Recommendations
For Cortex Enterprise:
For Cortex DIT, DIT+, and Dailies Editions:
- Windows 7 or Windows 10 x64 (PC only)
- 64 GB RAM (minimum)
- Intel Xeon CPU
- 2 x 6-core Intel 3.3 GHz
Or
AMD Threadripper 2, either 16 or 32 core CPU
recommended for best rendering and playback performance- 2 x GeForce GTX 2080 Ti or GTX 1080 Ti (minimum 8GB memory)
- Video Cards: Kona 4, Kona 5, Decklink series
- Windows 7 or Windows 10 x64 (PC or Mac running bootcamp)
- 32 GB RAM (minimum)
- Intel Xeon CPU
- 2 x 6--core Intel 3.3 GHz
Or
AMD Threadripper 2, either 16 or 32 core CPU
recommended for best rendering and playback performance- 1 x GeForce GTX 2080 Ti or GTX 1080 Ti (minimum 8GB memory)
- Video Cards: Kona 4, Kona 5, Decklink series
I think you may be right. Coming up with a 3rd IO die for TR when you can push some rebranded Epyc's may be the way to go.Regarding HEDT, I suspect there is a good chance that Ryzen Threadripper is replaced by EPYC. With HEDT squeezed between an increasingly powerful AM4 mainstream platform and a competitive first and soon second generation EPYC workstation platform, AMD might not see further investment in Ryzen Threadripper as cost-effective. Perhaps they'll use the Threadripper branding for EPYC workstations.
Regarding HEDT, I suspect there is a good chance that Ryzen Threadripper is replaced by EPYC. With HEDT squeezed between an increasingly powerful AM4 mainstream platform and a competitive first and soon second generation EPYC workstation platform, AMD might not see further investment in Ryzen Threadripper as cost-effective. Perhaps they'll use the Threadripper branding for EPYC workstations.
I think you may be right. Coming up with a 3rd IO die for TR when you can push some rebranded Epyc's may be the way to go.
Thank you very much. I really am deaf. It happened before my cancer surgery, and was most likely caused by the cancer drugs they used to try and kill the cancer.(that didn't work) So I have been deaf for about 6 months now. Just thought I would let you know that I really was serious.
Thank you very much. I really am deaf. It happened before my cancer surgery, and was most likely caused by the cancer drugs they used to try and kill the cancer.(that didn't work) So I have been deaf for about 6 months now. Just thought I would let you know that I really was serious.
I would hope so.
I've been able to use DDR4-3200 CL14 since launch with Samsung B-die memory in a 4x8GB single rank stick configuration. AGESA 1.0.0.4 improved this to allowing for DDR4-3333+ CL14 with tightened timings. All on a X370 motherboard (Gigabyte K7) with 1st gen Ryzen.
If they can't do that on the 3000 series (highly unlikely) then it would be a serious regression.
Here we go lads.. Id's habbening. PCIE Gen 4 Nvme for X570 :
https://www.eteknix.com/worlds-first-pcie-4-0-m-2-nvme-ssd-announced-by-gigabyte/
Here we go lads.. Id's habbening. PCIE Gen 4 Nvme for X570 :
https://www.eteknix.com/worlds-first-pcie-4-0-m-2-nvme-ssd-announced-by-gigabyte/
I've been watching closely how this is unfolding. It is understood that the memory controller is simply better in 2nd gen and definitely in the to be announced 3rd gen AMD processors. However, the memory companies are using this as way to make higher profits and shut down a quality product. B-die was everywhere some years back and easy to identify. It's a high quality/binned stick of ram that was quite versatile and likely more expensive to manuf. If you look at the hot garbage they're putting out now and the ridiculous timings, it's enough to make your head spin. Some time ago it was 14ns across the board +/32/34 or 16ns and +Xx/XX. Now you have ridiculous garbage like 19-20-18-20-40 and all sorts of random bins. This is literally ram manufacturers throwing whatever hot garbage comes off the assembly line into a retail box. They're not even binning anymore. I have a good amount of b-die and I'm sure it will hold its own weight going into 3rd gen Ryzen. I wouldn't be surprised if the price doesn't sky rocket after they become unavailable because what is being put out now is hot garbage. The most hilarious aspect has been companies like G-skill continuing to use their premium b-die brand packaging on these garbage tier timings such that consumers are unable to descriminate unless they know about timings. Get your Rooohhyaall coating dumpster tier timing sticks for the low price of $200 :I think it's more for OEM standardization more than anything else. Asking regular people to hunt down B die is not realistic generally for a number if obvious reasons, not the least of which is Samsung ending production of it.
But fixing it up so it runs basically whatever common Ram at 3200 same as Intel is a big win and step forward, especially with 4 dimms.
Memory controller.. has nothing to do w/ the RAM. B-Die will kick the pants off garbage binned timing sticks on 1st gen/2nd gen/ and 3rd gen.My first 1700X experience was terrible going through various brands, speeds, bios versions, etc trying to figure out how to get even 3000mhz at 32GB (4x8GB). Finally gave out and bought a 2x16GB kit that worked and is in my 2700X now.
Post the voltage you're running through those sticks and the sub timings. Also post what the original stick is that you're using. CL15 on 4000? LOL, at what voltage and subtimings? Were talking stock JDEC not a week long OC trial and error experiment that roast your VRMs. Also, to restate .. you can only achieve that on high quality/highly binned sticks. You're not going to be able to do that on 19-20-18-30-64 rando bin sticks... and the performance at such timings revert right back to 3200 CL 14-14-14-14-3x or 3600 16-16-16-16-xx which was the whole point of high quality B-die.I know my 8086k isn't officially validated for 4000, but that's what I'm running there, and 4333 works as well. CL15 on the 4000, but the 4333 kit wouldn't go under 17, so I found it not worth it. I was building someone a delid 9900k with DH15U, and it ended up @ 5.2/4200 CL16 for best results.
Spending a month stabilizing ridiculous out of spec clocks complete w/ insane VRM melting voltages has already been debunked. You end up right back around B-die level 3200CL14 or 3600CL16 performance. The pro/con of AMD, as its currently configured is that the Ram performance flows directly through the CPU architecture via infinity fabric. Once that's decoupled, i'm sure you can run bob's budget 19-20-18-30-64 ram. However, the performance will never be comparable to lower subtiming and higher quality binned ram.I think Zen2 will have similar ceilings for great memory potential, undocumented or not, but at least also plug and play with run of the mill 3200 for Dell/HP/etc to make better off the shelf stuff.
For TR 32/48C will still make sense, FI a 32C at 250W@4GHz has not only 100% better perf than the alleged AM4 16C but has also somewhat better perf/watt at the plateform level.
A 24C is unlikely because it require 4 chiplets, unless yields are such that they have a massive inventory of dies with only 6/7C being functional.
I've been watching closely how this is unfolding. It is understood that the memory controller is simply better in 2nd gen and definitely in the to be announced 3rd gen AMD processors. However, the memory companies are using this as way to make higher profits and shut down a quality product. B-die was everywhere some years back and easy to identify. It's a high quality/binned stick of ram that was quite versatile and likely more expensive to manuf. If you look at the hot garbage they're putting out now and the ridiculous timings, it's enough to make your head spin. Some time ago it was 14ns across the board +/32/34 or 16ns and +Xx/XX. Now you have ridiculous garbage like 19-20-18-20-40 and all sorts of random bins. This is literally ram manufacturers throwing whatever hot garbage comes off the assembly line into a retail box. They're not even binning anymore. I have a good amount of b-die and I'm sure it will hold its own weight going into 3rd gen Ryzen. I wouldn't be surprised if the price doesn't sky rocket after they become unavailable because what is being put out now is hot garbage. The most hilarious aspect has been companies like G-skill continuing to use their premium b-die brand packaging on these garbage tier timings such that consumers are unable to descriminate unless they know about timings. Get your Rooohhyaall coating dumpster tier timing sticks for the low price of $200 :
This is a tragedy and despicable but typical of the Ram companies that have been milking their customers.
Memory controller.. has nothing to do w/ the RAM. B-Die will kick the pants off garbage binned timing sticks on 1st gen/2nd gen/ and 3rd gen.
Post the voltage you're running through those sticks and the sub timings. Also post what the original stick is that you're using. CL15 on 4000? LOL, at what voltage and subtimings? Were talking stock JDEC not a week long OC trial and error experiment that roast your VRMs. Also, to restate .. you can only achieve that on high quality/highly binned sticks. You're not going to be able to do that on 19-20-18-30-64 rando bin sticks... and the performance at such timings revert right back to 3200 CL 14-14-14-14-3x or 3600 16-16-16-16-xx which was the whole point of high quality B-die.
Spending a month stabilizing ridiculous out of spec clocks complete w/ insane VRM melting voltages has already been debunked. You end up right back around B-die level 3200CL14 or 3600CL16 performance. The pro/con of AMD, as its currently configured is that the Ram performance flows directly through the CPU architecture via infinity fabric. Once that's decoupled, i'm sure you can run bob's budget 19-20-18-30-64 ram. However, the performance will never be comparable to lower subtiming and higher quality binned ram.
If they were being true to quality, they would have announced what product will replace the high quality b-die they are phasing out. They haven't. So, it's clearly a higher margin money grab where they're going to throw any hot garbage they can at the CPUs now that the ram clocks/timings are decoupled from the core cpu architecture... much unlike wonderful intel.
I've been watching closely how this is unfolding. It is understood that the memory controller is simply better in 2nd gen and definitely in the to be announced 3rd gen AMD processors. However, the memory companies are using this as way to make higher profits and shut down a quality product. B-die was everywhere some years back and easy to identify. It's a high quality/binned stick of ram that was quite versatile and likely more expensive to manuf. If you look at the hot garbage they're putting out now and the ridiculous timings, it's enough to make your head spin. Some time ago it was 14ns across the board +/32/34 or 16ns and +Xx/XX. Now you have ridiculous garbage like 19-20-18-20-40 and all sorts of random bins. This is literally ram manufacturers throwing whatever hot garbage comes off the assembly line into a retail box. They're not even binning anymore. I have a good amount of b-die and I'm sure it will hold its own weight going into 3rd gen Ryzen. I wouldn't be surprised if the price doesn't sky rocket after they become unavailable because what is being put out now is hot garbage. The most hilarious aspect has been companies like G-skill continuing to use their premium b-die brand packaging on these garbage tier timings such that consumers are unable to descriminate unless they know about timings. Get your Rooohhyaall coating dumpster tier timing sticks for the low price of $200 :
This is a tragedy and despicable but typical of the Ram companies that have been milking their customers.
Memory controller.. has nothing to do w/ the RAM. B-Die will kick the pants off garbage binned timing sticks on 1st gen/2nd gen/ and 3rd gen.
Post the voltage you're running through those sticks and the sub timings. Also post what the original stick is that you're using. CL15 on 4000? LOL, at what voltage and subtimings? Were talking stock JDEC not a week long OC trial and error experiment that roast your VRMs. Also, to restate .. you can only achieve that on high quality/highly binned sticks. You're not going to be able to do that on 19-20-18-30-64 rando bin sticks... and the performance at such timings revert right back to 3200 CL 14-14-14-14-3x or 3600 16-16-16-16-xx which was the whole point of high quality B-die.
Spending a month stabilizing ridiculous out of spec clocks complete w/ insane VRM melting voltages has already been debunked. You end up right back around B-die level 3200CL14 or 3600CL16 performance. The pro/con of AMD, as its currently configured is that the Ram performance flows directly through the CPU architecture via infinity fabric. Once that's decoupled, i'm sure you can run bob's budget 19-20-18-30-64 ram. However, the performance will never be comparable to lower subtiming and higher quality binned ram.
If they were being true to quality, they would have announced what product will replace the high quality b-die they are phasing out. They haven't. So, it's clearly a higher margin money grab where they're going to throw any hot garbage they can at the CPUs now that the ram clocks/timings are decoupled from the core cpu architecture... much unlike wonderful intel.
Epyc is not threadripper. Threadripper is already a rebranded cut down epyc with higher clocks. You can't just drop an EPYC into a threadripper board.