Speculation: Ryzen 4000 series/Zen 3

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eek2121

Diamond Member
Aug 2, 2005
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The actual info given back when I said 7nm+ problems long ago:
K18.2 was on N7 and is a derivative part of K18.1
K19.x was never on N7 and isn't a derivative part of K18.1/K18.2.

Family 19h was always planned for 5nm.

The family introduced with Zen5 is targeting 3nm / 2nm at TSMC as extra info. Most of this was decided shortly after GloFo said nah about 7LP/3LP since 5LP was already canned. Family 19h fully switched to TSMC 5nm after 5LP was canned earlier(than 7nm/3nm being also canned).

May 31, 2018 -> As it appears, in a bid to provide more tangible advantages to its customers and not to invest in short-lasting nodes, the company is mulling skipping 5 nm manufacturing technology like it did with the 10 nm fabrication process. [They canned it in the docs => 5LP -> 3LP way before that, no mulling whatsoever]
August 27, 2018 -> The contract maker of semiconductors decided to cease development of bleeding edge manufacturing technologies and stop all work on its 7LP (7 nm) fabrication processes, which will not be used for any client. [Also, includes 3LP]
//Which is why AMD started working with TSMC on 5nm since 2018. With the most of the work being finished after April 3, 2019 and rest of 2019: Earlier this week TSMC announced that their 5-nanometer process technology has entered risk production. 5 nm PDKs are now available for production design and design components and rules have been delivered to their Open Innovation Platform (OIP), ready for customer designs.

Zen3 on N7 technically can only be K18.2. Since, Fam19h via the cores team is N5.

Fam 18h => increased vector width from 17h and misc/etc improvements per generation. (Native AVX256 -> Native AVX512)
Fam 19h => increased clock speeds and uniformity in execution units per generation. (No native AVX512 planned, the word is also no native AVX256 either)

Zen 3 is 19h. This has already been confirmed thanks to ongoing Linux kernel work.


N7+ confirmed, thanks to @Antey for originally pasting the link (earlier in this thread no less).

Zen3 will not be N7, N7P, or N6.

Zen 3 will not used N7 w/ EUV, 5nm, or 3nm. Zen 3 uses an optimized 7nm process. That is what AMD means by N7+. They have previously disclosed this and have not changed that disclosure.
 
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NostaSeronx

Diamond Member
Sep 18, 2011
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Zen 3 is 19h. This has already been confirmed thanks to ongoing Linux kernel work.
Zen2/Zen3 were 18h. Zen2 18h was moved to 17h with minimal to no feature loss. While, Zen3 18h was killed off. With that Zen3 was pushed to Family 19h. Family 19h before it got the Zen3 name was being ran on the 5nm node at AMD.

The Zen3 group for 18h was 2015-2017. With the JV-venture starting in 2016 and the selection of Fam 18h for Dhyana happening sometime before 2018. Kicking Zen2 from 18h to 17h and Zen3 from the 18h architecture to the 19h architecture. 18h plans for Zen3 =! 19h plans for Zen3, they are two different cores. 19h being on the 5nm family process and 18h being on the 7nm process family. There is no 7nm 19h core as there is no problems with 5nm.

Q2 2018 from Lisa Su:
We have seen the first view of 5-nanometer, and we think 5-nanometer is very competitive as well. So again, our goal is to use the best the process technology can offer in the foundry market, and then differentiate on architecture, and product positioning, and those kinds of things.

Q2 2019 from C. C. Wei:
We are confident that our 5-nanometer will have a strong ramp and be a large and long-lasting node for TSMC.

Why we are so upbeat on the 5-nanometer because we see that -- we forecast the ramp-up will be faster than, in terms of the revenue, faster than 7-nanometer. And we expect that our 5-nanometer as a solution to all the customers is very competitive.

///
7nm mass production start 2018 => production products from AMD first in 2018.
// AMD Rome/Matisse samples in December 2018, Instinct MI50/MI60 in November 2018.
That is with the difficulty of SAQP features and 193-nm ArFi blur effect from paper/computer schematic to printed/product schematic.

5nm mass production start 2020 => ???
// ??
No difficult features and no blur effect; and TSMC is meet competitive discounting and investing on faster TTM for 5nm harder than they did on 7nm.
 
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LightningZ71

Golden Member
Mar 10, 2017
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So, then, I guess the question is this: what's the difference between TSMC N7+ (as it refers to the AMD used Improved N7 process and what TSMC advertised as "6nm or N6"? Are they the same node, or was N6 canned for N7+?
 

JasonLD

Senior member
Aug 22, 2017
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So, then, I guess the question is this: what's the difference between TSMC N7+ (as it refers to the AMD used Improved N7 process and what TSMC advertised as "6nm or N6"? Are they the same node, or was N6 canned for N7+?

From Anandtech article.

While TSMC’s N6 uses new production equipment and offers 18% higher transistor density than the company’s N7 manufacturing technology, N6 uses the same design rules as N7 and enables designers of chips to re-use the same design ecosystem (e.g., tools, etc.), which will allow them to lower development costs. By contrast, N7+ uses different design rules, but also provides more advantages than N6 when compared to N7.


 
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NostaSeronx

Diamond Member
Sep 18, 2011
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So, then, I guess the question is this: what's the difference between TSMC N7+ (as it refers to the AMD used Improved N7 process and what TSMC advertised as "6nm or N6"? Are they the same node, or was N6 canned for N7+?
TSMC N7 => DUV FinFET w/ min feature of 57Cx/40Mx & M2P => 57Mx
TSMC N7+ => EUV FinFET w/ min feature of 57Cx/36Mx & M2P => 36Mx (Basically, do to older EUV software/tools it is a completely new node)
TSMC N7P (Improved & Evolved 7nm) => DUV FinFET w/ min feature of 57Cx/40Mx & M2P => 57Mx
TSMC N6 => EUV FinFET w/ min feature of 57Cx/40Mx & M2P => 57Mx (There should be an update on this with M2P supporting 36Mx and min 36Mx eventually)

N7+ = four layers of EUV on critical sections only.
N6 = five layers of EUV on four critical sections and one sub-critical section.
N5 = fourteen layers of EUV (Full EUV node)

N7+ is the one that is canned. As it is cheaper to do a RTO on N6(sim: Carrizo to Bristol) and a NTO on N6(sim: Kaveri to Carrizo).
 
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eek2121

Diamond Member
Aug 2, 2005
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Zen2/Zen3 were 18h. Zen2 18h was moved to 17h with minimal to no feature loss. While, Zen3 18h was killed off. With that Zen3 was pushed to Family 19h. Family 19h before it got the Zen3 name was being ran on the 5nm node at AMD.

The Zen3 group for 18h was 2015-2017. With the JV-venture starting in 2016 and the selection of Fam 18h for Dhyana happening sometime before 2018. Kicking Zen2 from 18h to 17h and Zen3 from the 18h architecture to the 19h architecture. 18h plans for Zen3 =! 19h plans for Zen3, they are two different cores. 19h being on the 5nm family process and 18h being on the 7nm process family. There is no 7nm 19h core as there is no problems with 5nm.

Q2 2018 from Lisa Su:
We have seen the first view of 5-nanometer, and we think 5-nanometer is very competitive as well. So again, our goal is to use the best the process technology can offer in the foundry market, and then differentiate on architecture, and product positioning, and those kinds of things.

Q2 2019 from C. C. Wei:
We are confident that our 5-nanometer will have a strong ramp and be a large and long-lasting node for TSMC.

Why we are so upbeat on the 5-nanometer because we see that -- we forecast the ramp-up will be faster than, in terms of the revenue, faster than 7-nanometer. And we expect that our 5-nanometer as a solution to all the customers is very competitive.

///
7nm mass production start 2018 => production products from AMD first in 2018.
// AMD Rome/Matisse samples in December 2018, Instinct MI50/MI60 in November 2018.
That is with the difficulty of SAQP features and 193-nm ArFi blur effect from paper/computer schematic to printed/product schematic.

5nm mass production start 2020 => ???
// ??
No difficult features and no blur effect; and TSMC is meet competitive discounting and investing on faster TTM for 5nm harder than they did on 7nm.

Nosta, you are full of it as usual. AMD employees have already sent over code to the Linux kernel team confirming Zen 3 is 19h. They did this a long time ago (many months). Go look yourself instead of spreading misinformation on this forum.

EDIT: AMD's public roadmaps have changed very little since July of last year.
 

NostaSeronx

Diamond Member
Sep 18, 2011
3,689
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AMD employees have already sent over code to the Linux kernel team confirming Zen 3 is 19h.
And, Family 19h is 5nm as per the cores team doing the 19h architecture said. The cores team doing Zen3/Zen4 based on 19h are only on N5.

Zen3 Family 18h is the only N7 Zen3 project, it was canned. They didn't push the core to 19h, rather 19h is a more power efficient core than 18h Zen3 was ever going to be. So, it was straight up canned.

Zen3 K18.2 N7-fam is not of Zen3 K19.x N5-fam.
Zen2 K18.1 N7-fam is Zen2 K17.3+ N7-fam though.
Arden CPU Zen2 Device 18h(K18.1) = Starship/Matisse/Renoir Zen2 17h(K17.3+).
Ariel CPU Zen2 Device 24(18h/K18.1) = Starship/Matisse/Renoir Zen2 17h(K17.3+).

Xbox Z-Series(Mx-APU?(dCPU+dGPU+IOD)) was set to use device 18h model 20h-2Fh(Zen3) on N7. It is now set on device 19h on N5(Also, Zen3).
^-- Speculations on that SoC, you know its name if you've been looking, is that it will be a 2022 part.

Family 18h 20h-2Fh Zen3 has not been switched to Family 19h Zen3.
It is two different cores;
Family 18h 20h-2Fh is the same evolutionary design up-tick of Family 18h 10h-1Fh; which happens to also be Family 17h and models 30h and greater. <== This chub-phatty Zen3 is only on N7.
Family 19h models any is a revolutionary design. <== This thin-stick Zen3 is only on N5.

V1.1 3D-IC Enabled
 
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Antey

Member
Jul 4, 2019
105
153
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Milan ES spotted

AMD Epyc (Milan) ES
OPN: 100-000000114-07_22/15_N
Turbo: 2.2 GHz
Base: 1.5 GHz


Architecture: x86_64
CPU op-mode(s): 32-bit, 64-bit
Byte Order: Little Endian
CPU(s): 256
On-line CPU(s) list: 0-255
Thread(s) per core: 2
Core(s) per socket: 64
Socket(s): 2
NUMA node(s): 2
Vendor ID: AuthenticAMD
CPU family: 25
Model: 0
Model name: AMD Eng Sample: 100-000000114-07_22/15_N
Stepping: 0

 

HurleyBird

Platinum Member
Apr 22, 2003
2,726
1,342
136
I don't doubt that AMD has worked with TSMC to have a Zen3 floorplan and design for N7 improved and N5p. It wouldn't shock me if AMD produced EPYC and desktop ryzen Chiplets for Zen3 on improved N7 and used N5p or N6 for Cezanne or a following product.

At the very least, it wouldn't shock me if AMD has been doing parallel development of 7nm and 5nm Zen 3 chiplets for at least a portion of the bring-up, even if the later never sees the light of day. Anything less would be squandering a fundamental advantage of chiplets.
 

A///

Diamond Member
Feb 24, 2017
4,352
3,155
136
I was going over the original launch dates of the 1800X, 2700X, 3700X, etc. There's a weird pattern of sequential numbers for the dates.
 
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DrMrLordX

Lifer
Apr 27, 2000
21,813
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They have previously disclosed this and have not changed that disclosure.

Since when?

The guy @Antey cited is basically a leaker like rogame, and is leaking various specs on upcoming AMD CPUs. AMD would be absolutely insane NOT to use N7+ (EUV node) on Milan.
 

NostaSeronx

Diamond Member
Sep 18, 2011
3,689
1,224
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Agree. Relatively low risk for gaining experience with EUV for ALL future nodes.
7nm+/6nm isn't considered full fledged EUV:
"Full-fledged EUV (i.e., more than ten EUV layers) is employed to replace at least 4 times more immersion layers at cut, contact, via and metal line masking steps for process simplification, faster cycle time and better reliability & yields. Total mask count is reduced for the first time in the 5nm node which uses several masks less than [the] previous 7nm node "
What they learn in 7nm+/6nm in partial EUV might not apply in 5nm full-fledged EUV.

Just throwing some shade:
"Two instances of 256Mb HD and HC sram along with large logic test chip are included in the 5nm qualification vehicle. This 5nm has consistently achieved very high yield in 256Mb SRAM and logic test chip: >90% peak yield and ~80% average yield (without repair) in 256Mb HC and HD SRAM."

The die is 32 MB of 0.21 micro-m2 SRAM and 32 MB of 0.25 micro-m2 SRAM (at worst it is 64 MB each: 2i of 256Mb HD & HC) and a large product-like section(along with). Hence, the CPU and GPU plots. These style of product-like qualifications are always worst case scenarios being larger than 125 mm2. Since, Apple might press the button at any time. It is courteous to be ~90mm2 and down-right rude to do ~125 mm2 and ~121 mm2.

I know it is confusing as if it was speaking of two different products. However, the qualification vehicle die is singular not plural and the 256Mb and logic test chip is the same chip of the previous sentence. As it talks about HC&HD SRAM w/ repair circuits on and off. It isn't just a small single 256 Mb HD SRAM w/o repair circuits and some willy nilly nothingburger logic. It is full production-ready IP. It quite literally states risk production had already happened which was with V1.0 PDK(Cadence-source). These theoretical small qualifications had already been done before risk.

TSMC doesn't want bad press in failing to launch small 1cm2 chips unlike certain other fabs. Recently because of neoverse, ARM usually helps with big die HPC qualifications as well.
Large mobile(aka product-like) die validation tests I have confirmed are 16nm(being the smallest and most unprepared)/10nm/7nm and 5nm(being the largest of the bunch).
 
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maddie

Diamond Member
Jul 18, 2010
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I am aware that 7+ is hybrid node, hence low risk and gaining experience part in my post. No need to write novel about it.
If the rules are different between 7nm and 5nm as NostaSeronx implies, then what experience is really gained outside of general die design and layout workflow?
 

randomhero

Member
Apr 28, 2020
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If the rules are different between 7nm and 5nm as NostaSeronx implies, then what experience is really gained outside of general die design and layout workflow?
EUV? Mask sets? And probably zillion other quirks to solve.
Nothing to sneeze at.
 

exquisitechar

Senior member
Apr 18, 2017
666
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Since when?

The guy @Antey cited is basically a leaker like rogame, and is leaking various specs on upcoming AMD CPUs. AMD would be absolutely insane NOT to use N7+ (EUV node) on Milan.
It's just people misinterpreting AMD changing 7nm+ to 7nm on their roadmap for Zen 3. It has already been already clarified that it doesn't mean that it isn't using EUV (with an AT article, no less), but people keep repeating this for some reason.
https://www.anandtech.com/show/1558...7nm-7nm-for-future-products-euv-not-specified
In order to avoid confusion, AMD is dropping the ‘+’ from its roadmaps. In speaking with AMD, the company confirmed that its next generations of 7nm products are likely to use process enhancements and the best high-performance libraries for the target market, however it is not explicity stating whether this would be N7P or N7+, just that it will be ‘better’ than the base N7 used in its first 7nm line.
Most importantly:
This doesn’t necessarily mean that AMD isn’t going to be using EUV in the future – we were told it will be on a case by case basis, and at this time they wanted to clarify that AMD is not making any specific clarifications of which version of 7nm from TSMC it plans to use.
They simply haven't disclosed whether they are using EUV or not yet. However, I think they are using it, and that's been publicly leaked already.
 
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NostaSeronx

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Sep 18, 2011
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^December 2017 7nm cost => 2018+ products use 7nm
^July 2019 5nm cost => ??+ products use 5nm

November 2019: 110k on 7nm and 50k on 5nm.
Wafer Start capacity.



Found V0.1 mention which makes it extremely likely that V1.0 was in Q1 2019 or shortly after. Readiness for tools outside of TSMC is a bit slower.

First publicly announced 5nm product tapeout in Aug 21st, 2019 which happened on March 8th, 2019.

There is enough room to do 5nm samples late in 2019. From a document stating Q1 2017 implied AMD being a member that worked on N5 specification with TSMC. (Rocket to 5nm group.)

There is also the MPW for 2020.

FinFET & FinFET Boost


Only FinFET Boost

Also, 7nm FinFET Plus(7nm+/N7+) is gone:

2018 -> 2019 btw had it move to Fab15.

Not related to AMD:
"Our N5P platform is being developed to enable our customer tape-out in Q4 2020." - http://www.alchip.com/solution/socdesign/leading-edge-process/
"Alchip Technologies to became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December.

The company expects that 5nm demand will come initially from high-performance cloud computing applications. Still, Alchip expects that 5nm devices will be 52% smaller, 3% faster, yet use only 36% of the power, compared to current 7nm devices." - http://www.alchip.com/press-release/alchip-technologies-opens-5nm-asic-design-capabilities/

The node N5P is not faster, but is more dense and low power. I guess for Alchip.

Designs on N5 can be retaped to N5P out like 14LPP to 12LP. With immediate mass production ramp.

Apple A12 => AMD Rome and Vega
Apple A13 => AMD Navi 1x
Apple A14 => Going to sit this one out guys, we think our 7nm product will be able to compete against 5nm Zeus/Poseidon.

Avera => Marvell
May 2020.
 
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