Originally posted by: NokiaDude
This is what happens with a "blob" application.
Our testing has shown that this method minimizes the possibility of air
bubbles and voids in the thermal interface between the heat spreader and
the heatsink. Since the vast majority of the heat from the core travels directly
through the heat spreader, it is more important to have a good interface
directly above the actual CPU core than it is to have the heat spreader
covered with compound from corner to corner.
Originally posted by: pillage2001
Originally posted by: Boogak
This is how not to do it.
WTF...he used the whole tube?!
Originally posted by: Boogak
This is how not to do it.
Originally posted by: psiu
http://notlikethis.hole.fi/?page=notlikethis&g=2&l=0
Just follow some of these examples...there's 3 or 4 pages worth....not really recommended for dial-up, btw.
Wow, some people are incredible....I mean, they're smart enough to have a job that'll let them pay for some of this stuff, you'd think they'd be smart enough to get directions and follow them...