Arachnotronic
Lifer
- Mar 10, 2006
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there is an Intel slide from about the time IVB launched showing 14nm in 2013. that was...optimistic.
No, Broadwell will be "well into production" by Q4 2013. Intel is right on target.
there is an Intel slide from about the time IVB launched showing 14nm in 2013. that was...optimistic.
Intel roughly spends 3 times more on foundry R&D than TSMC.
True, but the trajectory isn't looking so good for TSMC, IMHO. They have been on a capacity drive lately, but they are basically N-2 (counting FinFET as a node jump) at this point and it isn't getting any easier to stay there apparently.
Just saying, really - there is a risk that Intel decides it wants all the higher margin marbles. With this fumble (if it's true) some companies with the cash (i.e. Apple, Qualcomm) could be lured into a more secure arrangement if Intel can accept margins of ~50% for fab only customers.
Actually, at this point, with 450 mm wafers and EUV/Quad patterning on the horizon, I'm surprised Intel isn't pushing harder. They must really believe that they are going to own the phone and tablet markets with x86 by the time they get to that point. Interesting times...
Intel only allows companies access that doesnt compete with Intel.
It'll be quite interesting to see if this stance changes going forward - probably really depends upon how well received Intel's push into tablets and smartphones is next year. If it goes well then there's no reason to allow the competition into its fabs. If it continues to stagnate however then there's something to be said for selling wafers at a premium. Margins for Intel would be comparable or possibly even better than what they could sell their own designs for (all indications thus far are that Baytrail-T is priced well below the competition.) Whereas the increased silicon cost would take a hit on the competition's margins that they'd have to take lest they lose a competitive edge to the other ARM players... and best of all (for Intel) is the fact that they'd be taking all the lucrative sales from the other foundries.
I think it's safe to state that firms will line up around the block, so to speak, to get a chance at using Intel's fabs. It's a fine line for intel, though - how do they do this without enabling a competitor? I think Bay Trail will do fine but we will see.
I know this is a little bit off topic, but I am kind of surprised that Bay Trail at 22nm FinFet is not trouncing the ARM vendors at 28nm planar. I know its Intel's first try at it, but with their process lead they should be smacking their competition around. Fast forward a couple years with TSMC at 16/20nm FinFet, ARM will gain ground on Intel if they don't step up.
What were your expectations exactly? We don't have a lot of exact measurements but based on what we do know I'd say that BayTrail performs comparably with the best Android ARM systems while using maybe 40-70% as much power. That's a huge deal and easily exceeds what I'd expect from the process advantage alone. I think Intel has stepped up tremendously not just with its manufacturing but experience in CPU design at all levels.
It seems people are comparing it with A7's CPU, but I'm not aware we have any really useful power numbers for it. I would expect the gap there to be narrower, it's only natural given what Apple is putting behind this vs what their competitors are.
Really its just an educated guess based on prior and current data. I haven't really seen much of a power consumption test comparing Bay Trail vs. ARM vendors, except that Bay Trail was around 2-2.5W for intensive CPU benchmarks. If that is 40%+ less than ARM on the same benchmark then yes I completely agree Intel has a concrete edge. Do you have any links with Snapdragon or Tegra power consumption data?
Most phone SoCs use allot less, but we don't know what the top ARMv8 SoC will (or do) use. The A7 is the only ARMv8 SoC out there right now and I think AT estimated it at <= 2 Watts peak. I imagine there are some numbers out there for top of the line ARM Quads (ARMv7) which might give a better picture.
Out of curiosity, where did AT estimate A7 power consumption?
No, Broadwell will be "well into production" by Q4 2013. Intel is right on target.
"This is it, folks," he said. "Fourteen nanometers is here, it's working, and will be shipping by the end of this year."
Read that on the RWT forums, I'd have to search, not tonight though.
So by how much does TSMC's 16 nm trail Intel's 14 nm? About 1 year or so?TSMC shows off production 20nm and 16nm dev wafers
TSMC was showing off two wafers at Techcon, a production 20nm SoC and a pre-production 16nm without any qualifiers. Not many more details so for now just enjoy the pictures [see at link above].
On the 20nm front the wafers are not just in production, there are devices on the market using it that you can buy. No word on the higher performance variants but the SoC process is good to go. 16nm as the label suggests is still in development and that is on schedule. What is that schedule? Risk production in late 2014 so you should have 16nm FinFETs from TSMC in early 2015 if all goes well.
http://semiaccurate.com/2013/10/30/tsmc-shows-production-20nm-16nm-dev-wafers/
So by how much does TSMC's 16 nm trail Intel's 14 nm? About 1 year or so?
Also, shouldn't the sentence:
"On the 20nm front the wafers are not just in production"
be
"On the 20nm front the wafers are just in production"
otherwise I think it doesn't make sense?
key-word: "just"
They could change it to "only", but I guess that is clear if one doesn't take part of the sentence out of context...
Update from Oct 30, 2013:
http://semiaccurate.com/2013/10/30/tsmc-shows-production-20nm-16nm-dev-wafers/
So by how much does TSMC's 16 nm trail Intel's 14 nm? About 1 year or so?
No, from what I've read - TSMC's 16nm will be no where near Intel's 14nm in terms of density and electrostatics. Of course, TSMC will do just fine - their real competition is Samsung and GFL, who are pretty much following the same path but still up river compared to TSMC.
I'm not sure what sources he's read, but it's essentially common knowledge. TSMC and the other foundries can't keep up with Intel's metal pitches. GloFo and TSMC will be using their 20nm BEOL on their 14nm and 16nm processes, respectively (likely to keep costs down).Can we read it too?