Ultra 120 eXtreme loses King of Coolers title

[Spanki]

More good points and I happen to agree with most of them.

Originally posted by: gorobei
I wasn't actually talking about the cost of electricity, but rather if you do have to install 2-3 additional fans you'll want to upgrade a (arbitrary number here) 450W PSU to a 550W. For high quality PSUs that extra 100W can be a $30 bump in price. I knew someone might misinterpret, I was too lazy to bother clarifying. My bad.

At some point (or in some setups) it might be an issue, but for the most part, I still don't think it would make any difference. For example, my system is:

MSI P6n Platinum mb (nVida 650i-based)
E6400 @ 2.66GHz - stock volts (1.325)
Cooler Master Hyper Tx heatsink w/fan usually running @ ~9v (actually, it's PWM, running at 60%, so it gets 12v, 60% of the time)
XFX Extreme 7900 GS vga card
1 x 250GB Seagate Barracuda 7200.10 SATA drive
2 x 120GB Maxtor IDE drives
1 x TDK Dvd/CD IDE drive
1 x Antec Tri-Cool 120mm fan
1 x Sharkoon Silent Eagle 1000 120mm fan
2 x Yate Loon 120mm fans
(the Antec runs at ~5v, the others run at 12v)
1 x 60mm Vantec Stealth (NB cooler) @ 12v

...powered by a Xclio 550W GreatPower psu.

I have a power consumption meter on my UPS and at idle, the system draws ~202W. When running Orthos blend, it draws ~222W. Of course if all the drives were seeking around reading/writing files, it might draw a few more watts, but that's still well less than half the available wattage (actually the important measure is amperage, but I'm not too handy with the conversions ). Adding a few (or a dozen) fans is not going to put any strain on my power situation.

Originally posted by: gorobei
Was there a specific case with a ~150mm opening you referred to or was that just a "for instance" number? I'm not trying to be nit-picky or challenge your position, just curious what other removable tray types are out there. (I have a perverse plan to stick a tower H/S inside a SFF cube. Most cubes have a 3in or 75mm tall opening for the removable tray, so the Enzo Ultra-X(118mm) wouldn't fit either.)

Just a "for instance" number. My Antec P182 doesn't have a removable tray, but I know that they are one of the checklist items people often look for when buying a case. I hadn't done research to see exactly how much clearance any particular case has, but I've seen several people say something like "and I can finally remove my tray without removing the HSF first - yay!". Again, this would only be a benifit if it happened to work out that way in your case, so I was just using that as one possible checklist item some people might also be considering when they are looking for a HSF.

Far too often, I see someone start a thread with "Which heatsink should I get?" And the (equally bad) answer is usually "Get X, it rox!" (where X is whatever can be found at the top of some review chart at the time). Then a week later, heatsink arrives, user installs it, then returns to the forum... "hey, you guys said this was the one to get, but it (insert one or more of the following) -

* is way more expensive/heavy/sizeable/loud than I needed for my non-overclocked/mildly-overclocked system
* doesn't fit my motherboard
* doesn't fit my case
* is loud as hell
* my Orthos/TAT "load" results are much higher than I'm seeing on AT! (that's partly because they don't use those to measure with, but more on this later...)
* cools worse than the Y cooler I had
* won't fit with my side fan installed
* doesn't come with a fan!?
* has to be lapped???
* has to be installed with the motherboard removed?
* wouldn't slide back into my case, so I had to unmount it, slide my tray in and then mount it again - grrrr
* snapped my mb in half when I went 4-wheeling to the LAN party
* is not black!!
* looks like crap in my pimped-rig

...etc. . I guess people not stating thier criteria is a different subject, but the point is that people do have all sorts of criteria when shopping for a heatsink, so the more readily available info is, the easier it will be to find (if not by the people asking, at least by the people trying to help).

Originally posted by: gorobei
AT is probably a little remiss for not being more specific about the actual case layout/setup. But testing each cooler in a standard atx and a case better suited to top blowers would probably be a whole other can of worms.

Yeah, my biggest concern is not that they're not testing in 2-3 different configurations (that would be a lot of work), but more that they're drawing conclusions based on the current setup, without accounting for other reviews that show contrasting (sometimes a complete reverse) results.

Thier current accounting is:

- they've turned on the case fans and while the top-blowers improved, so did the side-blowers, so they consider that a wash.

- they've tested with the side removed and (IIRC) saw similar results to the above - but haven't tried a closed case with side fan, vs closed case with side vent (fan removed for Tower sinks, due to clearance issues) as far as I know.

- they say it's because they are using a modern (Core 2 Duo) chip and other sites are using older P4 chips (but it's unclear to me how/why a top-blower cools a P4 chip at some heat level than a side-blower does (reverse of the results AT gets) on that same chip/heat in those other reviews).

I'm still a bit puzzled as to exactly 'what' the difference is, but AT's setup seems to be tougher on top-blowers than other tester's setups. Not that they are the only ones seeing this 'general' result (MADSHRIMPS talks somewhat about this in the latest review, but with a smaller sample of top-blowers being tested), I'm just not convinced that all the data is in yet, so I wouldn't personally be comfortable drawing those conclusions until I had a decent understanding of the contrasting info (for example here and here, just to list a few).

Originally posted by: gorobei
Interestingly Frostytech uses some sort of simulation test to determine overall heat increase over ambient temp at 85W and 150W loads. (This would seem to be a better standard for testing general potential ability to cool separate from case layout issues. Though far less helpful in giving the reader a practical use, "real world" performance rating.)

Yeah, at least it's a fairly objective means of testing cooling efficiency. I do find FrostyTech's reviews to be a helpfull data point, but since it removes the case entirely, it leaves some open questions (I'd want to understand the mounting pressure/mechanism better on that setup).

Speaking of "real world" testing... Let me start by saying that I'm not trying to bash AT, thier methods or any of thier staff - I'm only bringing up these various points (any/all previous and future posts) to help make people aware that they need to read and understand the testing environment, before they can decipher the results they see in the charts effectively. And this is true for all sites/reviews - read the fine print! .

Back to "real world"...

- AT loops the Far Cry River demo for 30 mins, throws out any 'spikes' and averages the other temperatures they see to come up with a 'load' result. Interestingly, they do this in an attempt to use more "real world" conditions (rather than some artificial Orthos/TAT loading), but the problem it causes may make it more trouble than helpful... if you've spent any amount of time reading through forums and reviews about heatsinks/cooling, when you see someone mention 'load' temps... do you think "that must be thier Far Cry River demo looping for 30 mins" results? No. What you see are generally Orthos/TAT or some other artificial loading results. That doesn't make AT's method invalid, but it may cause confusion.

- they use a X6800 (14x multiplier). Raise your hand if you have one of those. Of course AT is an enthusiast-oriented site and they want to try to hit some really high overclocks, but it might make thier results harder to compare to your own. Just to be clear, at least they ARE using a Core 2 Duo, and if you know what stepping it is and what voltages are being used at each level, you can get some idea... other sites often use some hot-running P4 cpu, which is no better. The only meaningful conclusions you can draw from those might be the relationships between coolers tested under the same conditions (but even then you have to consider the rest of the test configuration).

- they have case fans turned off for testing. Raise your hand if you don't have any case fans (ok, so some minority of people don't have any case fans and some minority of people have X6800s too). I'm not sure why they disable the fans (I assume to do the dBA testing, but they could just disble them for that test), but it's a bit odd that they tune thier "load" conditions to try to simulate "real world" conditions, but then use a processor that noone owns and then turn off all thier case fans - puzzling .

...anyway, sorry for rambling and kudos to anyone who bothered to read all of this - some people collect stamps, I spent the last 4+ months reading heatsink reviews and forums... maybe it's time to switch to stamps .

 

[DrMrLordX]

Originally posted by: gorobei

Are we talking side vents or side fans? If it's simply a matter of having a grille in the side panel to allow cool air, then absolutely AT should redo their setup. If the main difference is having a side panel fan blowing straight at the topdown HS, one or two 120mm exhaust fans at the back, a top blow hole fan, and a couple of intake fans at the front; then the issue is a matter of case design and airflow theory.

Side vents, preferably situated close to the top of the top-down HSF so that it can pull air directly from outside the case. In my experience, side case fans do not help much. On my old machine, a Sempron 2800+, it originally had one of those P4 "air guides" screwed on to the inner part of the removable side panel. I took that off and installed an 80mm intake w/dust filter to achieve dust filtration at that point of entry and, presumably, give the stock HSF more cool air than it would have gotten from the piece of plastic that was there before. To my dismay, my temps rose 1-2C after I installed the side fan. At least I achieved the dust filteration I wanted, though.

Most builders(non-hardcore gaming overclockers running SLI) are going to have a basic case with a 120mm rear fan and maybe a front or side intake fan.
If top down heat sinks require you to have 2 or 3 additional [either side intake or exhaust] fans to barely outperform side blowing towers in a conventional case; then the additional cost of fans, increased PSU wattage to drive the fans, and additional noise suggests that you are throwing more horsepower at a problem when a rethink of the basic theory may prove more efficient and less costly. (i.e. P4 uber fsb madness to C2D mobile cpu parallel frugality)

Oh no no, if anything, top-down HSFs require fewer case fans than L-shaped HSFs. My setup, in the Centurion 5 I mentioned earlier, is nothing more than my HSF (Big Typhoon VX) and one exhaust fan. That's it. The side panel vent lets the HSF breathe properly, since it's so damn big that it almost touches the side panel anyway (were the vent offset too far, the HSF would have to struggle to get air in), and its exhaust cools the rest of the system. Then the exhaust fan moves HSF exhaust and everything else out the back. Pretty simple. All I did was get a Silverstone FM-121, mount that on the Big Typhoon VX, and then mount the VX's 86.5 cfm fan on the case as an exhaust fan. There's also a rinky-dink fan cooling my harddrive, but . . . it's pretty weak and it came with the case.

The issue I have with Anandtech's reviews is that it seems that they're running these HSFs in a closed case with no side vent AND no exhaust, which is a double-whammy on top-down HSFs. They have apparently run them individually with no case panel on and with an exhaust fan, but . . . not both. Plus, the exhaust fan probably wouldn't work at full potential if the case is open.

Their test bed is also probably penalizing L-shaped coolers, since they work best in an agressive wind tunnel setup, especially if you have other hot components in the system. Top-down coolers, in my opinion, are not necessarily appropriate in a wind-tunnel cooling situation because their airflow moves perpendicular to the airflow of the wind-tunnel, which causes turbulence and reduced case cooling efficiency.

 

[Spanki]

Interesting note about the side-fan vs side-vent-only... You'd think the fan would help bring in air, but maybe it interacted oddly with the HSF (turbulence). I'm guessing you'd have to test both ways on each system to figure out what works best.

 

[Spanki]

Originally posted by: Spanki
I have a power consumption meter on my UPS and at idle, the system draws ~202W. When running Orthos blend, it draws ~222W. Of course if all the drives were seeking around reading/writing files, it might draw a few more watts, but that's still well less than half the available wattage (actually the important measure is amperage, but I'm not too handy with the conversions ). Adding a few (or a dozen) fans is not going to put any strain on my power situation.

...just for completeness sake, I didn't really account for the vga card drawing more wattage if doing heavy 3D rendering and such in my example above, but I think that's still well within the bounds.

 

[aCynic2]

Originally posted by: five4o
How is it possible for the performance to be so different Ultra-X Sucks and Ultra-X Great

And I just ordered one

You'll be fine. Just make sure to lap it and do your best to make it flat. Also, if you're certain the CPU works, you may consider lapping that as well.

 

[DrMrLordX]

Originally posted by: Spanki
Interesting note about the side-fan vs side-vent-only... You'd think the fan would help bring in air, but maybe it interacted oddly with the HSF (turbulence). I'm guessing you'd have to test both ways on each system to figure out what works best.

I think the problem is that when you've got a top-down HSF being fed by a side-panel case fan, what you've got is a rather sloppy attempt at fan stacking. I've read before that fan stacking never really works unless you essentially connect the fans by way of some kind of tube or what have you (like those dual-fan Delta monstrosities that push 240 cfm). In other words, if you've got a 40 cfm case fan blowing down onto a top-down hsf using a 40 cfm fan, you gain no real benefit versus pulling the case fan and letting the HSF draw air in through an air guide or duct. If you've got a 40 cfm side case fan blowing down onto a top-down hsf using an 80 cfm fan, you may actually be interfering with the HSF's ability to pull air from outside the case.

In the case of my Sempron system, I suspect that the dust filter reduced the effective cfm of my side case fan to the point that it was a lower cfm than the stock AMD cooler's fan, which was probably causing the stock AMD cooler to pull air from inside the case rather than outside the case. I still left it where it was 'cuz I really wanted that intake filtered.

 

[BonzaiDuck]

Several points:

1) On the matter of "2x 1200" or two fans. Technical papers -- white-papers -- have stated (emphatically) that just putting two fans of the same size and/or make next to each other with serial airflow does not appreciably increase CFM. CFM only increases through the output fan significantly if one or more fans creates a higher preasure at the output-fan's "intake" than the output fan is capable of creating itself.

2) On standards in testing. I"ve stated many times, and make it an example here, that Maximum PC magazine chooses to review products that buy full-page color advertisements in the publication, and they consistently ignore top-end performers, while giving credit where less is due.

The only reviews to trust are reviews that make comprehensive comparisons with as large a number of similar products as possible. The AnandTech review on the Ultra-120-Extreme (March 7, 2007) does this in spades, even if it misses the Enzo.

It is hard to find any reviews which publish thermal resistance data on heatsink products. Certainly, Maximum PC Magazine avoids it like the plague. But other reviewers do publish some reviews with carefully run bench-test measurements of this index -- OverClockers is one, Hartware.de (German) is another. Often, by noting a cross-comparison in articles that only provide temperatures "at load and idle," you can estimate the thermal resistance of another product if it is compared to a model for which thermal resistance has been provided.

3) These heatpipe coolers are filled with coolant, such as water, designed to operate optimally in certain temperature ranges. So a test run at a room ambient of 40F may show wider variability between idle and load. But for the most part, in the "comfortable" zone of room ambients between 60+ and 75F, there is an absolutely linear relationship and 1 to 1 correspondence between an increase in room ambient (or the difference between ambients of two tests in two different articles) -- and the reported idle and load temperatures.

4) Again, on the matter of standards, you do not need to know whether the processor is a P4, and AMD, a Conroe or a Kentsfield -- IF -- the reviewer provides an accurate measure of the load thermal wattage of the bench-configuration processor at its over-clock setting. If the reviewer provides data for the bench-configuration at stock settings, then you only need to know the TDP published by the processor manufacturer -- assuming those specs are accurate, and I well know there was an issue a few years back about whether Intel was understating TDP specs for its processors. But I personally have not found any significant discrepancies on this issue.

To sum up, this is much like trying to become an authority on the JFK assassination. If you read a only one, single book on the topic, and go forward to profess that you know the answer, the naive may actually believe you, but those who are capable of critical thinking will conclude that you're a fool. Publications like Maximum PC aren't too different from Posner's "Case Closed:" Pick only the evidence that is useful to prove the theory you want to promote, and you can conclude "Oswald did it," while the galactically naive will believe you.

 

[JEDIYoda]

Originally posted by: BonzaiDuck
Several points:

1) On the matter of "2x 1200" or two fans. Technical papers -- white-papers -- have stated (emphatically) that just putting two fans of the same size and/or make next to each other with serial airflow does not appreciably increase CFM. CFM only increases through the output fan significantly if one or more fans creates a higher preasure at the output-fan's "intake" than the output fan is capable of creating itself.

2) On standards in testing. I"ve stated many times, and make it an example here, that Maximum PC magazine chooses to review products that buy full-page color advertisements in the publication, and they consistently ignore top-end performers, while giving credit where less is due.

The only reviews to trust are reviews that make comprehensive comparisons with as large a number of similar products as possible. The AnandTech review on the Ultra-120-Extreme (March 7, 2007) does this in spades, even if it misses the Enzo.

It is hard to find any reviews which publish thermal resistance data on heatsink products. Certainly, Maximum PC Magazine avoids it like the plague. But other reviewers do publish some reviews with carefully run bench-test measurements of this index -- OverClockers is one, Hartware.de (German) is another. Often, by noting a cross-comparison in articles that only provide temperatures "at load and idle," you can estimate the thermal resistance of another product if it is compared to a model for which thermal resistance has been provided.

3) These heatpipe coolers are filled with coolant, such as water, designed to operate optimally in certain temperature ranges. So a test run at a room ambient of 40F may show wider variability between idle and load. But for the most part, in the "comfortable" zone of room ambients between 60+ and 75F, there is an absolutely linear relationship and 1 to 1 correspondence between an increase in room ambient (or the difference between ambients of two tests in two different articles) -- and the reported idle and load temperatures.

4) Again, on the matter of standards, you do not need to know whether the processor is a P4, and AMD, a Conroe or a Kentsfield -- IF -- the reviewer provides an accurate measure of the load thermal wattage of the bench-configuration processor at its over-clock setting. If the reviewer provides data for the bench-configuration at stock settings, then you only need to know the TDP published by the processor manufacturer -- assuming those specs are accurate, and I well know there was an issue a few years back about whether Intel was understating TDP specs for its processors. But I personally have not found any significant discrepancies on this issue.

To sum up, this is much like trying to become an authority on the JFK assassination. If you read a only one, single book on the topic, and go forward to profess that you know the answer, the naive may actually believe you, but those who are capable of critical thinking will conclude that you're a fool. Publications like Maximum PC aren't too different from Posner's "Case Closed:" Pick only the evidence that is useful to prove the theory you want to promote, and you can conclude "Oswald did it," while the galactically naive will believe you.

Hello my friend!!! Always nice to read your posts!!

 

[BonzaiDuck]

Where has Galvanized Yankee been lately, Jedi?

 

[JEDIYoda]

you can find him at badcaps.com and johnnyGURU.com....I usually see him logged into Anands early Pacific time-- 7:00 approx...

 

[Check]

Kind of off topic but I can't wait to see what the Thermalright IFX-14 can do once it comes out.

 

[JEDIYoda]

Originally posted by: check
Kind of off topic but I can't wait to see what the Thermalright IFX-14 can do once it comes out.

Judging by what I have read and talked with people who sort of know...its not going to take down the Ultra120!!

It might be a teir 1 heatsink!! being ThermalRight and there reputation for quality we can onl;y wait and see!!

Thanks for reminding me I ned to pick one of those up!! lol

 

[BonzaiDuck]

I'm also interested in the IFX-14, but given the choice for orienting my VGA (8800 GTS) heatpipe cooler, I'm starting to budget and plan for water-cooling. Here are my reasons, Jedi:

1) If you over-clock a quad-core system with the thermal power of the Kenstfield, you won't get far without water-cooling. [It may happen that Intel does to the Kenstfield what it did with the Smithfield via Presler and culminating in Conroe.]

2) Case-space and motherboard eal-estate -- my biggest thorn in the side. Water-blocks do not obstruct PCI/-E slots and prevent the use thereof. The illusion that a plethora of hoses obstructs anything of importance is . . . . an ILLUSION.

and 3): Unless the IFX_14 shows me something -- remember that I've got my E6600 OC'd to around 3.3 at voltages between 1.4375 and 1.45V -- my absolutely great air-cooling temperatures cannot come close to dual-loop watercooling systems in comparisons of a) room ambient to idle, room ambient to load, and load to idle temperatures.

 

[JEDIYoda]

Originally posted by: BonzaiDuck
I'm also interested in the IFX-14, but given the choice for orienting my VGA (8800 GTS) heatpipe cooler, I'm starting to budget and plan for water-cooling. Here are my reasons, Jedi:

1) If you over-clock a quad-core system with the thermal power of the Kenstfield, you won't get far without water-cooling. [It may happen that Intel does to the Kenstfield what it did with the Smithfield via Presler and culminating in Conroe.]

2) Case-space and motherboard eal-estate -- my biggest thorn in the side. Water-blocks do not obstruct PCI/-E slots and prevent the use thereof. The illusion that a plethora of hoses obstructs anything of importance is . . . . an ILLUSION.

and 3): Unless the IFX_14 shows me something -- remember that I've got my E6600 OC'd to around 3.3 at voltages between 1.4375 and 1.45V -- my absolutely great air-cooling temperatures cannot come close to dual-loop watercooling systems in comparisons of a) room ambient to idle, room ambient to load, and load to idle temperatures.

Yes my friend!! I totally agree!!
I have also ben doing research into making the jump from air to water!!

I for one have my p4 3.2ee o/c`d to 4.2.........I had it oc`d to 4.4 and it was rock stable.......
In order to accomnplish that I have alot of air moving in my case....
I am also using CoolerMaster fans even with a max if 42cfm I am running those temps...even at 42 cfm they are pretty quiet....

I have tried other fans that push alot more air and I see no different results in fact there really is a point of diminishing returns..

Maybe I will be joining you on the water cooling curcuit!!


Peace!!

 

[JEDIYoda]

Originally posted by: Spanki
No worries, I read the entire thread. The part you seemed to miss is the link within there pointing to the Enzo thread.. where the guy used some TIM between the cap and base and picked up another few C (which was already bettering his Tuniq Tower).

Anyway, it's just silly to argue over 2-3C differences in these tests because we all know that results will vary from system to system, depending on airflow, mounting pressure, TIM being used, TIM application and other factors - ANY of which could cause a 2-3C swing in results, easily.

For some context of why I used that title for this thread, you may want to see my ealier thread . I'd still like to see AnandTech review the Ultra-X, but so far, they've been silent (unresponsive) for some reason.

(btw, I don't use words like 'pwned' in real life, which should give you some idea of my level of seriousness - I'm playing devil's advocate here).

It is impossible to review every new product when it comes out on the market....
Anad has no repsonsibility to inform us of their upcoming plans to review products....

From what i have sen the Enzo albeit a competitive heatsink just is not causing the interest and discussion that the Zalman 9500 or even the Scythe Ninja did when they came on the market!!

Peace!!

 

[Spanki]

Originally posted by: JEDIYoda
It is impossible to review every new product when it comes out on the market....
Anad has no repsonsibility to inform us of their upcoming plans to review products....

From what i have sen the Enzo albeit a competitive heatsink just is not causing the interest and discussion that the Zalman 9500 or even the Scythe Ninja did when they came on the market!!

Peace!!

Yep - there's hundreds (over time, or at least 'dozens' in an on-going basis) of heatsinks that never get reviewed on any site. Obviously the ones that get reviewed are the ones that are either foisted at the reviewers by manufacturers, or ones that show some promise/interest among the site's readers.

I guess "interest and discussion" is relative to where you hang out... the XS folks are pretty keen on the Enzo - plenty of interest and discussion about it over there. There's been plenty here as well.

Anyway, it's been reviewed here at AT now, so I'm happy. Now if we can just figure out why AT's test-bed is unkind to top-blowers, and see some more bang-for-buck type coolers reviewed here (ACF7Pro, CM Hyper Tx, etc.), all will be right in the world .

 

[Spanki]

Originally posted by: JEDIYoda
From what i have sen the Enzo albeit a competitive heatsink just is not causing the interest and discussion that the Zalman 9500 or even the Scythe Ninja did when they came on the market!!

..I'd also note what should be obvious... "interest and discussion" are the result of reviews in most cases, not the other way around. If Scythe sent the Ninja out to be reviewed before release and/or Zalman sent the 9500 out to be reviewed prior to or at the time of release, then that would be a huge factor in the "interest and discussion" being generated. Obviously one thing feeds the other, so as more interest and discussion ensues (based on initial reviews), more sites are likely to take notice and do even more reviews.

I think the Enzo unit suffers from it's initial limited availability, start-up-company status and the fact that they don't necessarily send out review samples. So the interest in it came about largely from word-of-mouth and more isolated reviews, due to it's quality and performance.

Just to be clear, I'm not some Enzo fan-boy... the thing is too heavy for my tastes and could use a fan-swap. But I do admire it's apparent build-quality, design and performance coming from a start-up.

If you copy this link and paste it into google's translation page and set the language to Rusian -> English, you'll see the original review this thread refers to.

On that test configuration, the Enzo (at it's lower ~1400rpm speed) out-performed:

Scythe Infinity w/1200rpm fan
Scythe Infinity w/2x1200rpm fans
Scythe Andy Samurai @1200rpm
Scythe Andy Samurai @2530rpm
T-Take Big Typhoon @1400rpm
T-Take Big Typhoon @2530rpm
Zalman 9700 LED @1700rpm
Zalman 9700 LED @2800rpm
Thermalright 120X @1200rpm

...and came within 2C of the 120X w/ 2x1200rpm fans. This was on a Q6600 @3.3GHz, 1.5v test system, in a closed ASUS case with side vents (as far as I can tell).

If you move up to the faster (and much louder) 2530rpm on the Enzo, it matches the 120X (and even out-performs it on the open-air configuration).

Obviously extreme overclockers often run faster/louder fans to keep things cool, but those numbers are pretty impressive, without making a lot of noise in the process.

 

[Rilla927]

I know this thread is a bit dated but I thought I would post this anyway. Here are some incredible results of the Enzotech cooling a Q6600.
Idle at 26, 26, 27, 27 and top out at 44, 43, 44, 43 - this guy mounted it where the heat pipes are right behind the exhaust, so to speak sideways. If you scroll down 2/3 of the page it is post#14 by 5010 click on the link to see results, also he gives more info on the 2nd page of this thread itself.
http://forums.extremeoverclock...howthread.php?t=267447