- May 7, 2002
- 10,376
- 762
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I don't get why they just don't fix the 40 μm height difference, yeah, they are different packagers, but, that don't explain why they are different in the first place. It should all be the same.
Why put the AIBs through these annoyances?
Add to that varying chip quality (and HBM2 quality as well), it really is a mess for them.
Why put the AIBs through these annoyances?
Add to that varying chip quality (and HBM2 quality as well), it really is a mess for them.