Originally posted by: Dinominant
So why not make the CPU cores cone shaped so they use the entire wafer? Uneven heating??--maybe AMD/INTEL could make a deal with some thermal compound company and literally pour it underneath there heat spreader instead of that glue.
I say we keep this tread going in hopes some AMD/INTEL engineer sees it and we spark a new idea.
Originally posted by: Dinominant
So why not make the CPU cores cone shaped so they use the entire wafer? Uneven heating??--maybe AMD/INTEL could make a deal with some thermal compound company and literally pour it underneath there heat spreader instead of that glue.
I say we keep this tread going in hopes some AMD/INTEL engineer sees it and we spark a new idea.
Originally posted by: MrThermistor
Why not extrude?
Originally posted by: Mday
Originally posted by: Dinominant
So why not make the CPU cores cone shaped so they use the entire wafer? Uneven heating??--maybe AMD/INTEL could make a deal with some thermal compound company and literally pour it underneath there heat spreader instead of that glue.
I say we keep this tread going in hopes some AMD/INTEL engineer sees it and we spark a new idea.
i think you mean wedge shaped... anyway, that usually means some unusual geometric arrangement. transistors are laid out in patterns for design and lithography. having a wedge shape would just complicate things. and the cores have to be separated. a rectangle is easier to cut out than a wedge.
No, most fabs use diamond saws to cut wafers.Originally posted by: RossGr
I was considering the difficulting of dicing non square die, but aren't a lot of fabs using lasers for dicing? If so it seem that irregular shapes should not be a problem.
The problem with irreguar die would be layout of the circiuts.
Originally posted by: Wingznut
No, most fabs use diamond saws to cut wafers.Originally posted by: RossGr
I was considering the difficulting of dicing non square die, but aren't a lot of fabs using lasers for dicing? If so it seem that irregular shapes should not be a problem.
The problem with irreguar die would be layout of the circiuts.
Another reason that hasn't been mentioned is manufacturing. Many of the steps require spinning the wafer (such as applying/developing photoresist), and there is no way you could get consistant coverage with a square wafer. There are also plenty of other steps in the manufacturing process which would be more difficult if the wafer were not round.
But really what it comes down to is cost. The difficulties in making/manufacturing a square wafer would significantly outweigh any cost by getting a few extra die.