I've been looking at Asus Z390 boards, but other brands are similar. The VRM sinks have no real fins, more like a few grooves. What hapenned to the importance of surface area? (Asus WS Z390 Pro pics below.)
(Click for Hi-Res)
I'm aware that chipsets do not get as hot as they used to, du to their high-speed functions being moved to the CPU, but what a bout VRMs?
Theory: Maybe VRM temps "spike" much more than a CPU's. Then, extra mass & heat capacity of a sink would be more advantageous than heat conductance. The extra mass would smooth out spikes, but convecting it outwards slowly. Yes I'm reading a physics textbook. Sawing more grooves would remove mass. But skiving or extrusion would not, yet still no fins?
(Click for Hi-Res)
I'm aware that chipsets do not get as hot as they used to, du to their high-speed functions being moved to the CPU, but what a bout VRMs?
Theory: Maybe VRM temps "spike" much more than a CPU's. Then, extra mass & heat capacity of a sink would be more advantageous than heat conductance. The extra mass would smooth out spikes, but convecting it outwards slowly. Yes I'm reading a physics textbook. Sawing more grooves would remove mass. But skiving or extrusion would not, yet still no fins?
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