It is worth noting that EUV hasn't been used in any production foundry process to date that I have heard of.
Instead of EUV starting at 20nm they moved to double patterning. In a chip you have layers of metal. 28nm+ those metals were each done once. So you'd have a single Metal 1 layer, single Metal 2 layer, etc so each of these would require one mask. Since EUV wasn't mature enough in order to get the wiring density necessary to take advantage on 20nm and smaller they moved to doing essentially two masks for a particular metal layer. So you'd have Metal 1 green and Metal 1 red, they are still on the same plane but now you have doubled the Metal 1 mask costs.
This is why TSMC 20nm didn't gain huge traction. It is still a planar fet but the mask costs are much higher. FinFet is expensive as well since they still use double and even triple patterning but you gain a lot more moving to finFet.
Yeah I don't think anyone has production EUV running. Most of the foundries are working to stretch their current fabs and scanners product life for a few more nodes. EUV is next gen stuff. I bet Samsung is working on a fab for it though. Building the fab to support EUV will very time consuming. Getting the air purified(has to be something like 1000x more pure than current fab systems), somehow setting the building up to resist vibrations or absorb them, training staff on the new suits and clean room procedures, getting electric distribution circuits brought in with enough juice to run all the equipment and developing automatic wafer handling systems that will be able to handle the products and move them. The logistics are crazy.
The immersion systems had their own unique set of issues. The water purification systems required for immersion are pretty stringent. If there are any types of particles/contaminants in the water that the excimer lasers shine through you introduce defects into your overlay. Getting the fab facilities management to fix water purity issues was one problem my brothers group was always fighting. They get called in to diagnose product issues and the water being supplied to their machine was not in spec.
The scanners themselves are so expensive as well. I think I heard somewhere that the Twin Scans cost about 30 million euros apiece brand new. And a fab usual has several scanners. That's just one machine out of the whole setup.
I'd be interested to know what vendor's equipment IBM used to run that 7nm chip. It's obviously an R&D fab not producing any sort of volume but there are a couple companies making EUV scanners besides ASML. I don't think IBM is building their own scanner but maybe I'm wrong.