Discussion Zen 5 Speculation (EPYC Turin and Strix Point/Granite Ridge - Ryzen 9000)

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deasd

Senior member
Dec 31, 2013
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Hm, so it's 26% faster. Nothing too special. We know about 16% average ipc, so this is just a bench in the upper region. Why is everyone acting as if it was super high?!

Yea, ‘Nothing too special’. Even the 2x% gaming number already on slides, people still decide not to believe. Dunno why we are riding on a DownplayTrain consciously since HypeTrain crashed.

It's even comparing to 14900k and no one care about.

 
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Hitman928

Diamond Member
Apr 15, 2012
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Dropping the power can only be seen as a good thing. Like I've already said in the other thread, it's one of the few things we can use to gauge gains that are independent of benchmarks and testing conditions. If some Zen 5 SKUs drop power by about 40-50W when compared with Zen 4 counterparts, then they have to do so while offering at least the same level of performance. (they would have to offer more, but you get the idea) This means that Zen 5 will be significantly more efficient than Zen 4, which falls in line with the performance figures we've seen for Strix (like 40% higher perf with 50% more cores, this is only possible if core power is lower by about 35%)

The really weird and concerning part is the benchmark selection they presented us with, especially considering they will be launching these CPUs relatively soon and before the competition (so there's no point in hiding things from them at this stage). Even now, we have no way of evaluating 1T performance of Zen 5. It makes no sense, the opsec part is over.

FWIW the leaked GB5 scores showed 15% - 20% performance per clock improvement in the integer test.
 

Joe NYC

Platinum Member
Jun 26, 2021
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There is a way AMD can surprise with V-Cache (over the normal V-Cache expectation)

Placing V-Cache over the entire CCD die, with ~128 MB of L3. Then, these can be joined using Wafer over Wafer stacking meaning the whole waver of SRAM on N6 on top or the whole Zen 5 CCD, instead of doing it one at the time.

Doing stacking this way would make it easy for AMD to make it a volume part, not a specialty part.

There are already some changes under way with the TSVs needed to connect to V-Cache stacked above. They seem to be missing from L3 area. So, it is possible the TSVs are spread around the die.

Power reduction of Zen 5 might make it possible to cool the chip fully covered with V-Cache - possibly. We are up to 3rd generation of V-Cache, which is a plenty of time for AMD to work on some breakthrough technology to conduct the heat from the CPU die up through the V-Cache
 

coercitiv

Diamond Member
Jan 24, 2014
6,387
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There is this:
You would think there is, but if you check the end notes for that slide... they say it's GB multi-core score. You can find the mobile slides here: https://www.anandtech.com/Gallery/Album/9476#25 (also be aware this slideshow contains the desktop endnotes as well, even though the desktop slides are in another article)

Are decreases or very slight increases in IPC likely for significant tests?
Their IPC figure is given for a mix of ST and MT workloads. According to their end note they were comparing at fixed clocks, but the SKUs chosen make no sense (9950X vs. 7700X) The problem with the benchmark mix is one cannot isolate MT or ST increase, it's a weird mix between the two.
 

CakeMonster

Golden Member
Nov 22, 2012
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My headcanon is still that Mike Clark assumed 3nm, and maybe was counting on something on the order of 22% instead of 16% in that presentation. That would have been received a lot more positively.
 

Hitman928

Diamond Member
Apr 15, 2012
5,593
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You would think there is, but if you check the end notes for that slide... they say it's GB multi-core score. You can find the mobile slides here: https://www.anandtech.com/Gallery/Album/9476#25 (also be aware this slideshow contains the desktop endnotes as well, even though the desktop slides are in another article)


Their IPC figure is given for a mix of ST and MT workloads. According to their end note they were comparing at fixed clocks, but the SKUs chosen make no sense (9950X vs. 7700X) The problem with the benchmark mix is one cannot isolate MT or ST increase, it's a weird mix between the two.

In the past, they have compared 16 core SKUs to 8 core SKUs at iso clocks but disabled one of the CCDs on the 16 core SKUs to match core count as well. I’m guessing the same thing happened here, they just forgot to mention one CCD was disabled.
 

Joe NYC

Platinum Member
Jun 26, 2021
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My headcanon is still that Mike Clark assumed 3nm, and maybe was counting on something on the order of 22% instead of 16% in that presentation. That would have been received a lot more positively.

It is quite peculiar that the die size of Zen 5 came to the same size as Zen 4. As if there was a set ceiling on how big the die could be, and they were able to only put it so many features as they could fit. And some features were cut.

If that was the case, then IMO, they made a mistake in including full AVX512 at expense of other features. Half width, like Zen 4, would have been just fine.

It is going to be a long time for us to get the theory validated - until Zen 6.
 

coercitiv

Diamond Member
Jan 24, 2014
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In the past, they have compared 16 core SKUs to 8 core SKUs at iso clocks but disabled one of the CCDs on the 16 core SKUs to match core count as well. I’m guessing the same thing happened here, they just forgot to mention one CCD was disabled.
This makes the most sense, the alternative being 9950X vs 7950X. There are more typos/small mistakes in the slides though, making the keynote materials seem rushed.
 

Joe NYC

Platinum Member
Jun 26, 2021
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AMD loves adhering to PPA metrics which is why some heads were lobbed off for RDNA3.

If performance gains from AVX-512 received weight proportional to die area used, then Zen 5 would have outstanding PPA improvements.

But since AVX-512 receives less weight in benchmarks, AVX is holding back the gains in PPA. Unless there is some reuse of the silicon...
 

DisEnchantment

Golden Member
Mar 3, 2017
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It is quite peculiar that the die size of Zen 5 came to the same size as Zen 4. As if there was a set ceiling on how big the die could be, and they were able to only put it so many features as they could fit. And some features were cut.
They added close to 2B more XTors, that is a massive increase. (1/2 of 20B XTor minus the IOD)
You can fit Zeppelin CCX (1.4B XTors) in there, just from the XTor increase


It is going to be a long time for us to get the theory validated - until Zen 6.

Zen 5 is not fully revealed, we will get more insights on the architecture and perf in a month or so.
 

HurleyBird

Platinum Member
Apr 22, 2003
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It is quite peculiar that the die size of Zen 5 came to the same size as Zen 4. As if there was a set ceiling on how big the die could be, and they were able to only put it so many features as they could fit. And some features were cut.

Given the different aspect (taller but less wide), likely a coincidence.
 
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eek2121

Diamond Member
Aug 2, 2005
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Intel apparently has some partners adding LPCAMM2 to boards. When compared side by side with a DIMM based board, the DIMM based board absolutely looks dated. Hopefully we see some action from the AMD camp, though I wonder if Zen 4/Zen 5 even support LPDDR5.
 
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tsamolotoff

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May 19, 2019
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Intel apparently has some partners adding LPCAMM2 to boards. When compared side by side with a DIMM based board, the DIMM based board absolutely looks dated. Hopefully we see some action from the AMD camp, though I wonder if Zen 4/Zen 5 even support LPDDR5.
And what advantages does it give? It'd be a scorching volcano for dual-sided sticks, there's no real benefit in mem speed as compared to proper 1dpc boards (if you look at these slides with 2dpc empty slot nubs), overall RAM size etc is the same as the current SS/DS sticks
 

Joe NYC

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Jun 26, 2021
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They added close to 2B more XTors, that is a massive increase. (1/2 of 20B XTor minus the IOD)
You can fit Zeppelin CCX (1.4B XTors) in there, just from the XTor increase




Zen 5 is not fully revealed, we will get more insights on the architecture and perf in a month or so.

Yup, that's a big increase in transistors and also in density The density increase is greater than density increase from (sub) node shrink.

I figured it is >26% increase in transistor count in the same area:
 
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