I bet Zen6 desktop parts will be branded under Ryzen AI 400 series.
You guys think it will be called Ryzen 11000?
It definitely won't be 11000 series, but I also hope the "AI" naming silliness ends when the bubble bursts, before medusa.
Anyway back to topic:
I really do hope Zen 6 makes some sweeping changes to the cache hierarchy, as client and server parts will finally be totally separated (Desktop using same silicon as high-end laptops)
1MB L2 + large L3 certainly makes sense on server chips, but as Qualcomm and Apple seem to show, large
shared L2 - up to 4 cores + MALL (Memory Attached Last Level Cache ) gives excellent results for client workloads. Though that's also with gargantuan L1 cache.(Intel's Lion Cove somewhat emulates it by renaming L1 to L0 and
adding another 192KB layer as L1, but I doubt AMD will go down that route)
We have some hints for the direction AMD might choose.
MI300C design has 64MB of MALL for each active-interposer chip (256MB in total) and
Strix Halo, which has both 32MB of L3 per chiplet + 32MB of MALL on separate chiplet.
Given that , MALL is probably a given (possibly also in stacked form for V-cache chips) - it's just too important for mobile chips (power draw) and it won't hurt desktop either. But given the fact that Zen 6 will be the biggest packaging change for AMD since ... Zen 1 really (with Halo being the pipe-cleaner) I really do hope that the also reshuffle parts of the "uncore" on CCDs to take the most of the changes.
What do you guys think? Will AMD go down their usual conservative approach, Keeping the 48K L1D, 1MB L2 (per core) and 32MB L3 (shared in a 8 core CCX), or will they do something more bold?
IMO there is room for improvement. Strix Halo cache layout just seems ... kinda wasteful: (2x32MB of L3 , 32MB of MALL, 16 x 1MB of L2 = 112MB in total) with > 1MB of cache only accessable at ~ 10ns L3 latency with a per core cap of 32MB.