I don't see them keeping the L3 cache levels the same. L3 cache is NOT shrinking as well as everything else and they are already increasing the number of cores by 50%. In addition, we have relatively solid information that this CCD will be used on mobile as well as desktop, so having that amount of cache is going to be prohibitive.
This is what I expect:
The cache die will switch to N4C as it's node.
The 12 core CCX will move to 24MB L3, keeping the mobile cache ratio of 2MB per core.
Every CCD will be able to have 3D cache at manufacturing time, though some will fail/disable this function.
The desktop parts will be in two series, a non-x series and an X3D series. The non-x parts will be economy priced and have no 3d cache. The X3D parts will.
I expect mobile will have a value monolithic part for the Ryzen 3 and 5 line, maybe 4p+4c. There will be a mainstream H line, which is similar to current Halo with 1 or 2 CCDs with no 3d cache. The HX line will be similar, but with 3d cache. Halo is differentiated by the io die with large iGPU.
I expect the 9 series to have 24 and 20 core parts, both with and without 3d cache. While there is room for a 16 core part, I don't see the value in that, maybe for OEMs.
The 7 series will be for top of the line 12 core CCDs.
The 5 series will be 8 core CCDs
The 3 series will more than likely be monolithic mobile parts.
Intel's move to have a base die with a lot of cache will force AMD'S hand here. They won't be able to be competitive at higher price points without 3d cache.
I don't think that reducing the L3 on the CCD will hurt as much due to the improved communications between the CCDs and the IOD for the lower end parts, in addition, 24MB is still more than the existing 16MB on mobile parts.