moinmoin
Diamond Member
- Jun 1, 2017
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Personally I think AMD's biggest problem is not each gen being a big enough improvement but rather their cadence slowing down. For years we were talking about them sticking to a cadence of around 16 months on average. Now it's becoming more and more clear that it's significantly longer than that, and that the change wasn't due to some slip ups. This increases the pressure on single per gen improvements.
With Zen 5 the talk was that the full core was intended for 3nm and the eventual 4nm version only got a compromised adaption. As far as I can see we never got any further info, like indications how Zen 5c on 3nm fares compared to Zen 5 4nm etc.
Ideally with one gen falling back the next gen, still executing as planned, would more than make up for it. Zen 6 going 2nm ("double shrink") may help.
But I feel we haven't really seen that play out like that with other AMD iterations, like with lackluster RDNA3 and the correction RDNA4. Is the latter really more than what RDNA3 originally promised plus some significant improvements on top?
Though I'd like to ask you, did you keep track of who is credited in those patents, so which group or department within AMD these patents can be credited to?
With Zen 5 the talk was that the full core was intended for 3nm and the eventual 4nm version only got a compromised adaption. As far as I can see we never got any further info, like indications how Zen 5c on 3nm fares compared to Zen 5 4nm etc.
Ideally with one gen falling back the next gen, still executing as planned, would more than make up for it. Zen 6 going 2nm ("double shrink") may help.
But I feel we haven't really seen that play out like that with other AMD iterations, like with lackluster RDNA3 and the correction RDNA4. Is the latter really more than what RDNA3 originally promised plus some significant improvements on top?
With RTG always having been big on packaging, packaging being a crucial part of AMD CPUs since Zen 1 Epyc/Threadripper and Zen 2 Ryzen, and Xilinx (being the other major specialist in packaging in the industry) merging with AMD since, I would say yes, AMD is definitely no doubt a packaging specialist.And from the patent trail from last quarter you'd imagine AMD is a packaging specialist than CPU designer. Not good. Typically patent trail is good indicator of active research in novel ideas but not since last two quarters unfortunately. At least not much applications in core design.
Though I'd like to ask you, did you keep track of who is credited in those patents, so which group or department within AMD these patents can be credited to?