Ok, tape out until Q2 + 18 months, so revenue in 2018.Ouch. Forget all about 2016 and then some.
They have absolutely no silicon yet. And it normally takes 12-18 months to end with a real product after that for CPUs.
But the key is tapping out in the next several months, samples and customers for the validation of the product over the 2016 time frame and then the revenue ramp happening in 2016.
That's not what he said. What he said wasHe said that they have no enginering sample, and it s logical since those wont be available before a few months, so i really dont see what is new that would had deserved a new thread.
We are in the final figure of executing and the milestone that you want hear us talk about is Zen tapping out, which should be over the next several months. And then putting samples in the hands of our customer and then starting portfolio of revenue in 2017.
Currently what they have at hand are partly or fully functional dies that are used to test the different blocks or even the full chip but wich will be slightly redesigned to definitly fix the caracteristics.
I don't know where these time after tapeout estimates come from. Maybe desktop CPUs have some much slower or stretched out processes. In mobile from tapeout to mass production is about 7 months, of which is 3 months to get silicon back from the fab and the rest is just validation and characterisation. We're talking about high-end FinFET SoCs here.
Edit : Final silicon is the one marked ES :
That's not what he said. What he said was
Source, other than the random forum poster who heard it from a guy who used to work at AMD who heard it from people he still knows there?
We are in the final figure of executing and the milestone that you want hear us talk about is Zen tapping out, which should be over the next several months. And then putting samples in the hands of our customer and then starting portfolio of revenue in 2017.
ESx: Evaluation silicon (for internal evaluation / qualification)
PC: Final silicon (Production Candidate, distributed to partners & press)
There are multiple levels of ES (1,2) parts in most cases. Usually the last two steppings are evaluated and cross referenced simulatenously.
The rest should be self explanatory.
I did read what was quoted. He did not say "We don't have engineering samples" which is what you claimed he said. He said they were going to tape out in a few months, which is an entirely different statement. I quoted the transcript, you are the one who put words into his mouth.You should better read what you re quoting :
The only sample that can be put on customer s hands are the one marked ES on the slide below :
It is months that we know what Kumar is saying, that is, that they wont be available before a few months.
That's not what he said. What he said wasHe said that they have no enginering sample, and it s logical since those wont be available before a few months, so i really dont see what is new that would had deserved a new thread.
We are in the final figure of executing and the milestone that you want hear us talk about is Zen tapping out, which should be over the next several months. And then putting samples in the hands of our customer and then starting portfolio of revenue in 2017.
I'd still like to know how you know they have partly or fully functional dies on hand.Currently what they have at hand are partly or fully functional dies that are used to test the different blocks or even the full chip but wich will be slightly redesigned to definitly fix the caracteristics.
Source, other than the random forum poster who heard it from a guy who used to work at AMD who heard it from people he still knows there?
I dont buy the 12 month number. Did Apple's A10 tape out 5 months ago? It would have had to because they start building phones in what, july?
The difference being what exactly when it comes to TTM (TimeToMarket) after tape out?This isn't mobile SoCs...
The quoted time indeed sounds too long. Unless AMD has cut down the number of staff working in the CPU teams in half, it shouldn´t take more than ~ 2 - 3 quaters.
I did read what was quoted. He did not say "We don't have engineering samples" which is what you claimed he said. He said they were going to tape out in a few months, which is an entirely different statement. I quoted the transcript, you are the one who put words into his mouth.
I dont buy the 12 month number. Did Apple's A10 tape out 5 months ago? It would have had to because they start building phones in what, july?
I don't know where these time after tapeout estimates come from.
Bulldozer took 15 months from tapeout to release as example. Barcelona took 14 months.
One of the fastest ever x86 tapeout to product in newer times was the P-4 with 10 months.
AMD announced Bulldozer tape out in July of 2010.
Do we think that AMD still will be in business as an independent company by early 2017 at the rate they are bleeding money?
Sure that a baker or a butcher wont hear the same thing than an EE even they are all three listening to the very same quote.
Other than that if you want to manuacture a few waffers at 14nm at Samsung or GF that s readily possible if you can pay for the 300k$/waffer for such tests chips.
July 2010 -> October 2011 launch means ~15 months.
AMD has taped out multiple products using GLOBALFOUNDRIES’ 14nm Low Power Plus (14LPP) process technology and is currently conducting validation work on 14LPP production samples.